TY - GEN
T1 - Signature of Topologically Persistent Points for 3D Point Cloud Description
AU - Beksi, William J.
AU - Papanikolopoulos, Nikolaos P
PY - 2018/9/10
Y1 - 2018/9/10
N2 - We present the Signature of Topologically Persistent Points (STPP), a global descriptor that encodes topological invariants of 3D point cloud data. These topological invariants include the zeroth and first homology groups and are computed using persistent homology, a method for finding the features of a topological space at different spatial resolutions. STPP is a competitive 3D point cloud descriptor when compared to the state of art and is resilient to noisy sensor data. We demonstrate experimentally on a publicly available RGB-D dataset that STPP can be used as a distinctive signature, thus allowing for 3D point cloud processing tasks such as object detection and classification.
AB - We present the Signature of Topologically Persistent Points (STPP), a global descriptor that encodes topological invariants of 3D point cloud data. These topological invariants include the zeroth and first homology groups and are computed using persistent homology, a method for finding the features of a topological space at different spatial resolutions. STPP is a competitive 3D point cloud descriptor when compared to the state of art and is resilient to noisy sensor data. We demonstrate experimentally on a publicly available RGB-D dataset that STPP can be used as a distinctive signature, thus allowing for 3D point cloud processing tasks such as object detection and classification.
UR - http://www.scopus.com/inward/record.url?scp=85063128142&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85063128142&partnerID=8YFLogxK
U2 - 10.1109/ICRA.2018.8460605
DO - 10.1109/ICRA.2018.8460605
M3 - Conference contribution
AN - SCOPUS:85063128142
T3 - Proceedings - IEEE International Conference on Robotics and Automation
SP - 3229
EP - 3234
BT - 2018 IEEE International Conference on Robotics and Automation, ICRA 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE International Conference on Robotics and Automation, ICRA 2018
Y2 - 21 May 2018 through 25 May 2018
ER -