TY - JOUR
T1 - SIAM
T2 - Chiplet-based Scalable In-Memory Acceleration with Mesh for Deep Neural Networks
AU - Krishnan, Gokul
AU - Mandal, Sumit K.
AU - Pannala, Manvitha
AU - Chakrabarti, Chaitali
AU - Seo, Jae Sun
AU - Ogras, Umit Y.
AU - Cao, Yu
N1 - Publisher Copyright:
© 2021 Association for Computing Machinery.
PY - 2021/10
Y1 - 2021/10
N2 - In-memory computing (IMC) on a monolithic chip for deep learning faces dramatic challenges on area, yield, and on-chip interconnection cost due to the ever-increasing model sizes. 2.5D integration or chiplet-based architectures interconnect multiple small chips (i.e., chiplets) to form a large computing system, presenting a feasible solution beyond a monolithic IMC architecture to accelerate large deep learning models. This paper presents a new benchmarking simulator, SIAM, to evaluate the performance of chiplet-based IMC architectures and explore the potential of such a paradigm shift in IMC architecture design. SIAM integrates device, circuit, architecture, network-on-chip (NoC), network-on-package (NoP), and DRAM access models to realize an end-to-end system. SIAM is scalable in its support of a wide range of deep neural networks (DNNs), customizable to various network structures and configurations, and capable of efficient design space exploration. We demonstrate the flexibility, scalability, and simulation speed of SIAM by benchmarking different state-of-the-art DNNs with CIFAR-10, CIFAR-100, and ImageNet datasets. We further calibrate the simulation results with a published silicon result, SIMBA. The chiplet-based IMC architecture obtained through SIAM shows 130 and 72 improvement in energy-efficiency for ResNet-50 on the ImageNet dataset compared to Nvidia V100 and T4 GPUs.
AB - In-memory computing (IMC) on a monolithic chip for deep learning faces dramatic challenges on area, yield, and on-chip interconnection cost due to the ever-increasing model sizes. 2.5D integration or chiplet-based architectures interconnect multiple small chips (i.e., chiplets) to form a large computing system, presenting a feasible solution beyond a monolithic IMC architecture to accelerate large deep learning models. This paper presents a new benchmarking simulator, SIAM, to evaluate the performance of chiplet-based IMC architectures and explore the potential of such a paradigm shift in IMC architecture design. SIAM integrates device, circuit, architecture, network-on-chip (NoC), network-on-package (NoP), and DRAM access models to realize an end-to-end system. SIAM is scalable in its support of a wide range of deep neural networks (DNNs), customizable to various network structures and configurations, and capable of efficient design space exploration. We demonstrate the flexibility, scalability, and simulation speed of SIAM by benchmarking different state-of-the-art DNNs with CIFAR-10, CIFAR-100, and ImageNet datasets. We further calibrate the simulation results with a published silicon result, SIMBA. The chiplet-based IMC architecture obtained through SIAM shows 130 and 72 improvement in energy-efficiency for ResNet-50 on the ImageNet dataset compared to Nvidia V100 and T4 GPUs.
KW - Chiplet architecture
KW - DNN acceleration
KW - IMC benchmarking
KW - in-memory compute
KW - network-on-chip
KW - network-on-package
UR - http://www.scopus.com/inward/record.url?scp=85115832331&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85115832331&partnerID=8YFLogxK
U2 - 10.1145/3476999
DO - 10.1145/3476999
M3 - Article
AN - SCOPUS:85115832331
SN - 1539-9087
VL - 20
JO - ACM Transactions on Embedded Computing Systems
JF - ACM Transactions on Embedded Computing Systems
IS - 5s
M1 - 68
ER -