Self-Assembled Multifunctional 3D Microdevices

Daeha Joung, Kriti Agarwal, Hyeong Ryeol Park, Chao Liu, Sang Hyun Oh, Jeong Hyun Cho

Research output: Contribution to journalArticlepeer-review

22 Scopus citations


Multifunctional 3D microstructures have been extensively investigated for the development of new classes of electronic and optical devices. Here, functionalized, free-standing, hollow, 3D, dielectric (150 nm thick aluminum oxide) microcontainers with metal patterning on their surfaces are realized by an evolved self-assembly approach. To functionalize the 3D structure and use it as a device, metal patterns, arrays of split-ring resonators (SRRs) acting as metamaterials, are defined on the surface of the 3D dielectric microcontainers. The SRRs on all six facets of a given microcube show a resonant behavior in terahertz regimes. Since desired metal and semiconductor patterns can be incorporated onto surfaces of 3D dielectric microstructures, this self-assembly process can be harnessed in developing next-generation microdevices utilizing the numerous advantages of 3D configurations.

Original languageEnglish (US)
Article number1500459
JournalAdvanced Electronic Materials
Issue number6
StatePublished - Jun 1 2016

Bibliographical note

Publisher Copyright:
© 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim


  • 3D microstructures
  • functionalization
  • self-assembly
  • surface patterning
  • THz split ring resonators

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