Keyphrases
Self-aligned
100%
High Aspect Ratio
100%
Capillarity
100%
Metallic Conductor
100%
Mechanical Adhesion
100%
Flow Adhesion
100%
Roll-to-roll
66%
Low Resistance
66%
Additive Manufacturing
66%
Micron-scale
33%
High-resolution
33%
Plastic Substrate
33%
Capillary
33%
Debonding
33%
Stress Development
33%
Flow Time
33%
Capillary Flow
33%
Channel Geometry
33%
Connected Network
33%
Fabrication Challenges
33%
Silver Deposition
33%
Electroless Plating
33%
Flow Channel
33%
Flexible Printed Electronics
33%
Silver-coated
33%
Metal Interconnect
33%
Process Window
33%
Copper Stress
33%
Ambient Humidity
33%
Plastic Film
33%
Plating Conditions
33%
Silver Ink
33%
Linear Resistance
33%
Conductive Traces
33%
Engineering
Capillarity
100%
Mechanical Adhesion
100%
High Aspect Ratio
100%
Microchannel
66%
Conductive
33%
Channel Geometry
33%
Centimeter
33%
Interconnects
33%
Printed Electronics
33%
Debonding
33%
Flow Channel
33%
Processing Window
33%
Flow Time
33%
Linear Resistance
33%
High Resolution
33%
Plastic Film
33%
Electroless Plating
33%
Material Science
Plating
100%
Conductor
100%
Capillarity
100%
Silver
66%
Debonding
33%
Electroless Deposition
33%
Plastic Film
33%
Chemical Engineering
Electroless Plating
100%
Film
100%