Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt %) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 ωm wide. This approach enables printing of high-resolution silver lines with widths as small as 22 μm. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 × 10-6 ω cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75%).
|Original language||English (US)|
|Number of pages||6|
|Journal||ACS Applied Materials and Interfaces|
|State||Published - Jun 17 2015|
Bibliographical notePublisher Copyright:
© 2015 American Chemical Society.
- plastic substrates
- printed electronics
- screen printing
- silicon stencils
- silver ink