Scaling analysis and a critical thickness criterion for thermosetting composites

Thomas W. Secord, Kim A. Stelson, Susan C. Mantell

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In composites processing, the combination of thickness, mold temperature, and resin kinetics can lead to temperature overshoot within a part during cure. In this paper, the interplay between these variables was considered to establish a critical thickness separating parts having large overshoots from parts having small overshoots. The one-dimensional heat equation with an autocatalytic relation for curing was used to model the process. The equations were placed in dimensionless form using a scaling analysis. Five dimensionless groups were identified. Two of these groups were found to affect the overshoot of the temperature: the modified Damköhler number Da*, which distinguishes thin and thick composites and the dimensionless temperature ramp rate t̄rise, which depends on the boundary condition and heat transfer characteristics of the composite. To validate the scaling analysis, a finite difference model was created to calculate part temperatures during cure. The numerical analysis confirms that thin and thick parts, as defined by the relative temperature overshoot, can be predicted by Da* and t̄rise.

Original languageEnglish (US)
Title of host publicationProceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Materials
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Print)0791837904, 9780791837900
DOIs
StatePublished - 2006
Event2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States
Duration: Nov 5 2006Nov 10 2006

Publication series

NameAmerican Society of Mechanical Engineers, Materials Division (Publication) MD
ISSN (Print)1071-6939

Conference

Conference2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Country/TerritoryUnited States
CityChicago, IL
Period11/5/0611/10/06

Fingerprint

Dive into the research topics of 'Scaling analysis and a critical thickness criterion for thermosetting composites'. Together they form a unique fingerprint.

Cite this