RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications

Yu Tao Yang; Haoxiang Ren; Su Kong Chong; Gang Qiu; Shu Yun Ku; Yang Cheng; Chaowei Hu; Tiema Qian; Kuan Neng Chen; Ni Ni; Kang L. Wang; Subramanian S. Iyer

doi:10.1109/ECTC51906.2022.00154

RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications

Yu Tao Yang
, Haoxiang Ren
, Su Kong Chong
, Gang Qiu
, Shu Yun Ku
, Yang Cheng
, Chaowei Hu
, Tiema Qian
, Kuan Neng Chen
, Ni Ni
, Kang L. Wang
, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

To preserve delicate quantum signals (few hundreds to a few tens of μV), low-loss and low-crosstalk inter-dielet communication is a must in a wafer-scale integrated quantum system using Superconducting-IF. In this paper, inter-dielet links (short: 125 μm and 500 μm; long: 1750 μm) with L/S (2/2 and 5/5 μm) are characterized in a broadband 20 GHz range through simulation and experiments at 4K A compact assembly (inter-dielet spacing of 100 μm) through the quantum-compatible fine-pitch (10 um) Au interlayer is conducted. For insertion loss and crosstalk characterization, the simulated and measured results are presented to be low-loss (<1 dB) and low-crosstalk (< -23 dB) in the broadband 20 GHz range with short (≤ 500 um) and long (1750 um) links and two L/S (2/2 and 5/5 um). It is one of the first 20 GHz broadband RF characterization of short superconducting links (≤ 500 um) through advanced packaging for cryogenic inter-dielet quantum communication. This work brings large-scale quantum computing closer to being realized through compact heterogeneous integration.

Original language	English (US)
Title of host publication	Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	949-955
Number of pages	7
ISBN (Electronic)	9781665479431
DOIs	https://doi.org/10.1109/ECTC51906.2022.00154
State	Published - 2022
Externally published	Yes
Event	72nd IEEE Electronic Components and Technology Conference, ECTC 2022 - San Diego, United States Duration: May 31 2022 → Jun 3 2022

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2022-May
ISSN (Print)	0569-5503

Conference

Conference	72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Country/Territory	United States
City	San Diego
Period	5/31/22 → 6/3/22

Bibliographical note

Publisher Copyright:
© 2022 IEEE.

Keywords

Au interlayer
Superconducting Silicon Interocnnect Fabric
heterogeneous integration

Publisher link

10.1109/ECTC51906.2022.00154

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Cite this

Yang, Y. T., Ren, H., Chong, S. K., Qiu, G., Ku, S. Y., Cheng, Y., Hu, C., Qian, T., Chen, K. N., Ni, N., Wang, K. L., & Iyer, S. S. (2022). RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications. In Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022 (pp. 949-955). (Proceedings - Electronic Components and Technology Conference; Vol. 2022-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC51906.2022.00154

RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications. / Yang, Yu Tao; Ren, Haoxiang; Chong, Su Kong et al.
Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 949-955 (Proceedings - Electronic Components and Technology Conference; Vol. 2022-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yang, YT, Ren, H, Chong, SK, Qiu, G, Ku, SY, Cheng, Y, Hu, C, Qian, T, Chen, KN, Ni, N, Wang, KL & Iyer, SS 2022, RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications. in Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Proceedings - Electronic Components and Technology Conference, vol. 2022-May, Institute of Electrical and Electronics Engineers Inc., pp. 949-955, 72nd IEEE Electronic Components and Technology Conference, ECTC 2022, San Diego, United States, 5/31/22. https://doi.org/10.1109/ECTC51906.2022.00154

Yang YT, Ren H, Chong SK, Qiu G, Ku SY, Cheng Y et al. RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications. In Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Institute of Electrical and Electronics Engineers Inc. 2022. p. 949-955. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC51906.2022.00154

Yang, Yu Tao ; Ren, Haoxiang ; Chong, Su Kong et al. / RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications. Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 949-955 (Proceedings - Electronic Components and Technology Conference).

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abstract = "To preserve delicate quantum signals (few hundreds to a few tens of μV), low-loss and low-crosstalk inter-dielet communication is a must in a wafer-scale integrated quantum system using Superconducting-IF. In this paper, inter-dielet links (short: 125 μm and 500 μm; long: 1750 μm) with L/S (2/2 and 5/5 μm) are characterized in a broadband 20 GHz range through simulation and experiments at 4K A compact assembly (inter-dielet spacing of 100 μm) through the quantum-compatible fine-pitch (10 um) Au interlayer is conducted. For insertion loss and crosstalk characterization, the simulated and measured results are presented to be low-loss (<1 dB) and low-crosstalk (< -23 dB) in the broadband 20 GHz range with short (≤ 500 um) and long (1750 um) links and two L/S (2/2 and 5/5 um). It is one of the first 20 GHz broadband RF characterization of short superconducting links (≤ 500 um) through advanced packaging for cryogenic inter-dielet quantum communication. This work brings large-scale quantum computing closer to being realized through compact heterogeneous integration.",

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AB - To preserve delicate quantum signals (few hundreds to a few tens of μV), low-loss and low-crosstalk inter-dielet communication is a must in a wafer-scale integrated quantum system using Superconducting-IF. In this paper, inter-dielet links (short: 125 μm and 500 μm; long: 1750 μm) with L/S (2/2 and 5/5 μm) are characterized in a broadband 20 GHz range through simulation and experiments at 4K A compact assembly (inter-dielet spacing of 100 μm) through the quantum-compatible fine-pitch (10 um) Au interlayer is conducted. For insertion loss and crosstalk characterization, the simulated and measured results are presented to be low-loss (<1 dB) and low-crosstalk (< -23 dB) in the broadband 20 GHz range with short (≤ 500 um) and long (1750 um) links and two L/S (2/2 and 5/5 um). It is one of the first 20 GHz broadband RF characterization of short superconducting links (≤ 500 um) through advanced packaging for cryogenic inter-dielet quantum communication. This work brings large-scale quantum computing closer to being realized through compact heterogeneous integration.

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RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications

Abstract

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Keywords

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