Repair of MEMS failure parts using FIB writing technology

In MEMS fields, many moveable parts, such as cantilevers, bridges and chains et al., can be affected by inevitable process technologies, which will lead many negative influences, such as residual stress, deformations, etc. After its liberation, strain will be generated. In addition, other fundamental mechanical parameters, such as resonant frequency, will be deviated from ideal ones. Focused on MEMS resonant devices, combining focused ion beam writing technology, repair has been carried out, by which the resonant frequency will be changed to the ideal ones. Moreover, the reliability lifetime of the repaired parts has been studied and a conclusion has been made that there is no obvious effects of FIB on MEMS parts.