Abstract
The continued scaling of silicon fabrication technology has led to significant reliability concerns, which are quickly becoming a dominant design challenge. Design integrity is threatened by complexity challenges in the form of immense designs defying complete verification, and physical challenges such as silicon aging and soft errors, which impair correct system operation. The Gigascale Systems Research Center Resilient-System Design Team is addressing these key challenges through synergistic research thrusts, ranging from near-term reliability stress reduction techniques to methods for improving the quality of today's silicon, to longer-term technologies that can detect, recover, and repair faulty systems. These efforts are supported and complemented by an active fault-modeling research effort and a strong focus on functional-verification methodologies. The team's goal is to provide highly effective, low-cost solutions to ensure both correctness and reliability in future designs and technology nodes, thereby extending the lifetime of silicon fabrication technologies beyond what can be currently foreseen as profitable.
Original language | English (US) |
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Pages (from-to) | 322-332 |
Number of pages | 11 |
Journal | IEEE Design and Test of Computers |
Volume | 25 |
Issue number | 4 |
DOIs | |
State | Published - 2008 |
Externally published | Yes |
Bibliographical note
Funding Information:We acknowledge the support of the Gigascale Systems Research Center (GSRC). This work (and our related work) is also supported by grants from the National Science Foundation and Semiconductor Research Corp.
Keywords
- Degradation
- Fabrication
- Fault-modeling research
- GSRC
- Integrated circuit reliability
- Reliability
- Reliability engineering
- Reliability stress reduction
- Reliable systems
- Resilient-System Design Team
- Silicon
- Silicon fabrication technologies
- Stress
- Unreliable fabrics