Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects

Nestor Evmorfopoulos; Mohammad Abdullah Al Shohel; Olympia Axelou; Pavlos Stoikos; Vidya A. Chhabria; Sachin S. Sapatnekar

doi:10.1145/3569052.3578919

Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects

Nestor Evmorfopoulos
, Mohammad Abdullah Al Shohel
, Olympia Axelou
, Pavlos Stoikos
, Vidya A. Chhabria
, Sachin S. Sapatnekar

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

Traditional approaches to analyzing electromigration (EM) in on-chip interconnects are largely driven by semi-empirical models. However, such methods are inexact for the typical multisegment lines that are found in modern integrated circuits. This paper overviews recent advances in analyzing EM in on-chip interconnect structures based on physics-based models that use partial differential equations, with appropriate boundary conditions, to capture the impact of electron-wind and back-stress forces within an interconnect, across multiple wire segments. Methods for both steady-state and transient analysis are presented, highlighting approaches that can solve these problems with a computation time that is linear in the number of wire segments in the interconnect.

Original language	English (US)
Title of host publication	ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design
Publisher	Association for Computing Machinery
Pages	115-123
Number of pages	9
ISBN (Electronic)	9781450399784
DOIs	https://doi.org/10.1145/3569052.3578919
State	Published - Mar 26 2023
Event	32nd ACM International Symposium on Physical Design, ISPD 2023 - Virtual, Online, United States Duration: Mar 26 2023 → Mar 29 2023

Publication series

Name	Proceedings of the 2023 International Symposium on Physical Design

Conference

Conference	32nd ACM International Symposium on Physical Design, ISPD 2023
Country/Territory	United States
City	Virtual, Online
Period	3/26/23 → 3/29/23

Bibliographical note

Funding Information:
This paper has presented a summary of recent computationally efficient physics-based approaches to solving the problem of EM analysis of multisegment interconnect wires. Solutions to both the steady-state problem, used to identify immortal wires, and the transient problem, which determines stress evolution as a function of time, are presented. Based on the resurgence of interest in this area, its importance to modern chip design, and the development of fast, linear-time approaches for solving these problems, we anticipate significant developments in this area in the near future. An open question remains as to how physics-based methods can interact with foundry models. This is a topic for future investigation. Acknowledgments: This work was supported in part by the National Science Foundation under award 1714805 and by SPAWAR under contract N660011824048.

Publisher Copyright:
© 2023 ACM.

Keywords

Electromigration
Multisegment interconnects
Reliability
Steady-state analysis
Stress
Transient analysis

Publisher link

10.1145/3569052.3578919

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Evmorfopoulos, N., Shohel, M. A. A., Axelou, O., Stoikos, P., Chhabria, V. A., & Sapatnekar, S. S. (2023). Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. In ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design (pp. 115-123). (Proceedings of the 2023 International Symposium on Physical Design). Association for Computing Machinery. https://doi.org/10.1145/3569052.3578919

Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. / Evmorfopoulos, Nestor; Shohel, Mohammad Abdullah Al; Axelou, Olympia et al.
ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery, 2023. p. 115-123 (Proceedings of the 2023 International Symposium on Physical Design).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Evmorfopoulos, N, Shohel, MAA, Axelou, O, Stoikos, P, Chhabria, VA & Sapatnekar, SS 2023, Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. in ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Proceedings of the 2023 International Symposium on Physical Design, Association for Computing Machinery, pp. 115-123, 32nd ACM International Symposium on Physical Design, ISPD 2023, Virtual, Online, United States, 3/26/23. https://doi.org/10.1145/3569052.3578919

Evmorfopoulos N, Shohel MAA, Axelou O, Stoikos P, Chhabria VA, Sapatnekar SS. Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. In ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery. 2023. p. 115-123. (Proceedings of the 2023 International Symposium on Physical Design). doi: 10.1145/3569052.3578919

Evmorfopoulos, Nestor ; Shohel, Mohammad Abdullah Al ; Axelou, Olympia et al. / Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery, 2023. pp. 115-123 (Proceedings of the 2023 International Symposium on Physical Design).

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abstract = "Traditional approaches to analyzing electromigration (EM) in on-chip interconnects are largely driven by semi-empirical models. However, such methods are inexact for the typical multisegment lines that are found in modern integrated circuits. This paper overviews recent advances in analyzing EM in on-chip interconnect structures based on physics-based models that use partial differential equations, with appropriate boundary conditions, to capture the impact of electron-wind and back-stress forces within an interconnect, across multiple wire segments. Methods for both steady-state and transient analysis are presented, highlighting approaches that can solve these problems with a computation time that is linear in the number of wire segments in the interconnect.",

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Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects

Abstract

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