Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects

Nestor Evmorfopoulos; Mohammad Abdullah Al Shohel; Olympia Axelou; Pavlos Stoikos; Vidya A. Chhabria; Sachin S. Sapatnekar

doi:10.1145/3569052.3578919

Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects

Nestor Evmorfopoulos, Mohammad Abdullah Al Shohel, Olympia Axelou, Pavlos Stoikos, Vidya A. Chhabria, Sachin S. Sapatnekar

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Traditional approaches to analyzing electromigration (EM) in on-chip interconnects are largely driven by semi-empirical models. However, such methods are inexact for the typical multisegment lines that are found in modern integrated circuits. This paper overviews recent advances in analyzing EM in on-chip interconnect structures based on physics-based models that use partial differential equations, with appropriate boundary conditions, to capture the impact of electron-wind and back-stress forces within an interconnect, across multiple wire segments. Methods for both steady-state and transient analysis are presented, highlighting approaches that can solve these problems with a computation time that is linear in the number of wire segments in the interconnect.

Original language	English (US)
Title of host publication	ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design
Publisher	Association for Computing Machinery
Pages	115-123
Number of pages	9
ISBN (Electronic)	9781450399784
DOIs	https://doi.org/10.1145/3569052.3578919
State	Published - Mar 26 2023
Event	32nd ACM International Symposium on Physical Design, ISPD 2023 - Virtual, Online, United States Duration: Mar 26 2023 → Mar 29 2023

Publication series

Name	Proceedings of the 2023 International Symposium on Physical Design

Conference

Conference	32nd ACM International Symposium on Physical Design, ISPD 2023
Country/Territory	United States
City	Virtual, Online
Period	3/26/23 → 3/29/23

Bibliographical note

Funding Information:
This paper has presented a summary of recent computationally efficient physics-based approaches to solving the problem of EM analysis of multisegment interconnect wires. Solutions to both the steady-state problem, used to identify immortal wires, and the transient problem, which determines stress evolution as a function of time, are presented. Based on the resurgence of interest in this area, its importance to modern chip design, and the development of fast, linear-time approaches for solving these problems, we anticipate significant developments in this area in the near future. An open question remains as to how physics-based methods can interact with foundry models. This is a topic for future investigation. Acknowledgments: This work was supported in part by the National Science Foundation under award 1714805 and by SPAWAR under contract N660011824048.

Publisher Copyright:
© 2023 ACM.

Keywords

Electromigration
Multisegment interconnects
Reliability
Steady-state analysis
Stress
Transient analysis

Publisher link

10.1145/3569052.3578919

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Cite this

Evmorfopoulos, N., Shohel, M. A. A., Axelou, O., Stoikos, P., Chhabria, V. A., & Sapatnekar, S. S. (2023). Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. In ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design (pp. 115-123). (Proceedings of the 2023 International Symposium on Physical Design). Association for Computing Machinery. https://doi.org/10.1145/3569052.3578919

Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. / Evmorfopoulos, Nestor; Shohel, Mohammad Abdullah Al; Axelou, Olympia et al.
ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery, 2023. p. 115-123 (Proceedings of the 2023 International Symposium on Physical Design).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Evmorfopoulos, N, Shohel, MAA, Axelou, O, Stoikos, P, Chhabria, VA & Sapatnekar, SS 2023, Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. in ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Proceedings of the 2023 International Symposium on Physical Design, Association for Computing Machinery, pp. 115-123, 32nd ACM International Symposium on Physical Design, ISPD 2023, Virtual, Online, United States, 3/26/23. https://doi.org/10.1145/3569052.3578919

Evmorfopoulos N, Shohel MAA, Axelou O, Stoikos P, Chhabria VA, Sapatnekar SS. Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. In ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery. 2023. p. 115-123. (Proceedings of the 2023 International Symposium on Physical Design). doi: 10.1145/3569052.3578919

Evmorfopoulos, Nestor ; Shohel, Mohammad Abdullah Al ; Axelou, Olympia et al. / Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects. ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery, 2023. pp. 115-123 (Proceedings of the 2023 International Symposium on Physical Design).

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Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects

Abstract

Publication series

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Bibliographical note

Keywords

Publisher link

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