Recent developments in thin film adhesion measurement

Megan J. Cordill; David F. Bahr; Neville R. Moody; William W. Gerberich

doi:10.1109/TDMR.2004.829071

Recent developments in thin film adhesion measurement

Megan J. Cordill, David F. Bahr, Neville R. Moody, William W. Gerberich

Chemical Engineering and Materials Science

Research output: Contribution to journal › Article › peer-review

74 Scopus citations

Abstract

Interfacial fracture energies of thin films may be calculated using many different techniques. Nanoindentation and stressed overlayers are by far the most common and more reliable of the testing techniques. They depend on mechanics-based models to calculate the interfacial fracture energy of an interface using only the site specific material properties and the dimensions of the delaminated region, either in spontaneous buckle or indentation-induced blister form. This study will focus on four adhesion measurement techniques: spontaneous buckles, stressed overlayer-induced buckles, and nanoindentation-induced blisters with and without stressed overlayers, to demonstrate that the techniques will produce similar results for the measurement of adhesion energy. Films of tungsten (W), platinum (Pt), and titanium (Ti) on SiO₂ (amorphous glass) substrates are examined and values of interfacial fracture energies reported. Results of interfacial fracture energy calculated from spontaneous buckles and indentation-induced blisters compare well to one another and values are reported for the aforementioned films.

Original language	English (US)
Pages (from-to)	163-168
Number of pages	6
Journal	IEEE Transactions on Device and Materials Reliability
Volume	4
Issue number	2
DOIs	https://doi.org/10.1109/TDMR.2004.829071
State	Published - Jun 2004

Bibliographical note

Funding Information:
Manuscript received February 17, 2004; revised March 15, 2004. The work of M. J. Cordill and D. F. Bahr was supported in part by the U.S. Department of Energy through the PECASE program under Contract DE-AC04-94AL85000. The work of M. J. Cordill and W. W. Gerberich was supported in part by the National Science Foundation under Contract NSF CMS 0322436.

Keywords

Adhesion
Interfacial fracture energy
Nanoindentation
Thin films

Publisher link

10.1109/TDMR.2004.829071

Find It

Find It at U of M Libraries

Cite this

@article{7d060bf782784e68a562c2942088c201,

title = "Recent developments in thin film adhesion measurement",

abstract = "Interfacial fracture energies of thin films may be calculated using many different techniques. Nanoindentation and stressed overlayers are by far the most common and more reliable of the testing techniques. They depend on mechanics-based models to calculate the interfacial fracture energy of an interface using only the site specific material properties and the dimensions of the delaminated region, either in spontaneous buckle or indentation-induced blister form. This study will focus on four adhesion measurement techniques: spontaneous buckles, stressed overlayer-induced buckles, and nanoindentation-induced blisters with and without stressed overlayers, to demonstrate that the techniques will produce similar results for the measurement of adhesion energy. Films of tungsten (W), platinum (Pt), and titanium (Ti) on SiO2 (amorphous glass) substrates are examined and values of interfacial fracture energies reported. Results of interfacial fracture energy calculated from spontaneous buckles and indentation-induced blisters compare well to one another and values are reported for the aforementioned films.",

keywords = "Adhesion, Interfacial fracture energy, Nanoindentation, Thin films",

author = "Cordill, {Megan J.} and Bahr, {David F.} and Moody, {Neville R.} and Gerberich, {William W.}",

note = "Funding Information: Manuscript received February 17, 2004; revised March 15, 2004. The work of M. J. Cordill and D. F. Bahr was supported in part by the U.S. Department of Energy through the PECASE program under Contract DE-AC04-94AL85000. The work of M. J. Cordill and W. W. Gerberich was supported in part by the National Science Foundation under Contract NSF CMS 0322436.",

year = "2004",

month = jun,

doi = "10.1109/TDMR.2004.829071",

language = "English (US)",

volume = "4",

pages = "163--168",

journal = "IEEE Transactions on Device and Materials Reliability",

issn = "1530-4388",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "2",

}

TY - JOUR

T1 - Recent developments in thin film adhesion measurement

AU - Cordill, Megan J.

AU - Bahr, David F.

AU - Moody, Neville R.

AU - Gerberich, William W.

N1 - Funding Information: Manuscript received February 17, 2004; revised March 15, 2004. The work of M. J. Cordill and D. F. Bahr was supported in part by the U.S. Department of Energy through the PECASE program under Contract DE-AC04-94AL85000. The work of M. J. Cordill and W. W. Gerberich was supported in part by the National Science Foundation under Contract NSF CMS 0322436.

PY - 2004/6

Y1 - 2004/6

N2 - Interfacial fracture energies of thin films may be calculated using many different techniques. Nanoindentation and stressed overlayers are by far the most common and more reliable of the testing techniques. They depend on mechanics-based models to calculate the interfacial fracture energy of an interface using only the site specific material properties and the dimensions of the delaminated region, either in spontaneous buckle or indentation-induced blister form. This study will focus on four adhesion measurement techniques: spontaneous buckles, stressed overlayer-induced buckles, and nanoindentation-induced blisters with and without stressed overlayers, to demonstrate that the techniques will produce similar results for the measurement of adhesion energy. Films of tungsten (W), platinum (Pt), and titanium (Ti) on SiO2 (amorphous glass) substrates are examined and values of interfacial fracture energies reported. Results of interfacial fracture energy calculated from spontaneous buckles and indentation-induced blisters compare well to one another and values are reported for the aforementioned films.

AB - Interfacial fracture energies of thin films may be calculated using many different techniques. Nanoindentation and stressed overlayers are by far the most common and more reliable of the testing techniques. They depend on mechanics-based models to calculate the interfacial fracture energy of an interface using only the site specific material properties and the dimensions of the delaminated region, either in spontaneous buckle or indentation-induced blister form. This study will focus on four adhesion measurement techniques: spontaneous buckles, stressed overlayer-induced buckles, and nanoindentation-induced blisters with and without stressed overlayers, to demonstrate that the techniques will produce similar results for the measurement of adhesion energy. Films of tungsten (W), platinum (Pt), and titanium (Ti) on SiO2 (amorphous glass) substrates are examined and values of interfacial fracture energies reported. Results of interfacial fracture energy calculated from spontaneous buckles and indentation-induced blisters compare well to one another and values are reported for the aforementioned films.

KW - Adhesion

KW - Interfacial fracture energy

KW - Nanoindentation

KW - Thin films

UR - http://www.scopus.com/inward/record.url?scp=4043160613&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=4043160613&partnerID=8YFLogxK

U2 - 10.1109/TDMR.2004.829071

DO - 10.1109/TDMR.2004.829071

M3 - Article

AN - SCOPUS:4043160613

SN - 1530-4388

VL - 4

SP - 163

EP - 168

JO - IEEE Transactions on Device and Materials Reliability

JF - IEEE Transactions on Device and Materials Reliability

IS - 2

ER -

Recent developments in thin film adhesion measurement

Abstract

Bibliographical note

Keywords

Publisher link

Find It

Other files and links

Fingerprint

Cite this