Abstract
A unified approach to the modelling, simulation, and control of thin film processing is presented. The focus of this approach is to combine in-situ sensing with a model that deals directly with evolving surfaces. Using this method, and an in-situ process modelling technique (e.g., plasma emission spectroscopy during reactive ion etching) is used as a source of inout data for a model which deals exclusively with interface evolution. In this way, in-situ monitoring gives predictive process control capability, rather than simple end-point detection.
Original language | English (US) |
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Pages (from-to) | 249-260 |
Number of pages | 12 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 3213 |
DOIs | |
State | Published - 1997 |
Event | Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III - Austin, TX, United States Duration: Jan 10 1997 → Jan 10 1997 |
Keywords
- Control
- Curvature driven flows
- Estimation
- Etching
- In-situ monitoring