Programmable via using indirectly heated phase-change switch for reconfigurable logic applications

Ku N. Chen, L. Krusin-Elbaum, D. M. Newns, B. G. Elmegreen, R. Cheek, N. Rana, A. M. Young, S. J. Koester, C. Lam

Research output: Contribution to journalArticlepeer-review

31 Scopus citations

Abstract

A novel concept for a programmable via using an indirectly heated phase-change switch is proposed and fabricated successfully. In this device concept, circuits associated with the programmable via are decoupled from the configuration circuits by using an independently contacted heater electrode. We demonstrate the prototype device in a standard 180-nm CMOS copper back-end technology.

Original languageEnglish (US)
Pages (from-to)131-133
Number of pages3
JournalIEEE Electron Device Letters
Volume29
Issue number1
DOIs
StatePublished - Jan 2008

Bibliographical note

Funding Information:
Manuscript received September 13, 2007. This work was supported by Defense Advanced Research Projects Agency (DARPA) under SSC SAN DIEGO Contract N66001-04-C-8032. The review of this letter was arranged by Editor S. Kawamura. The authors are with the IBM T.J. Watson Research Center, Yorktown Heights, NY 10598 USA (e-mail: [email protected]). Digital Object Identifier 10.1109/LED.2007.912016 Fig. 1. Programmable-via concept. Solid filled structures represent the implemented prototype device.

Keywords

  • Phase change
  • Programmable
  • Reconfigurable
  • Via

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