Predicting electromigration mortality under temperature and product lifetime specifications

Vivek Mishra, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Scopus citations

Abstract

Today's methodologies for electromigration (EM) identify EM-susceptible wires based on their current density, using the Blech criterion to filter out wires that are EM-immortal. The Blech criterion is agnostic to the product lifetime and temperature conditions: many Blech-mortal wires may never experience EM during the product lifetime. We develop new methods that evaluate the transient evolution of stress, relative to the product lifetime, and present an improved set of simple and practical mortality criteria. On a set of power grid benchmarks, we demonstrate that the actual number of mortal wires may depend strongly on the lifetime and reliability conditions.

Original languageEnglish (US)
Title of host publicationProceedings of the 53rd Annual Design Automation Conference, DAC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450342360
DOIs
StatePublished - Jun 5 2016
Event53rd Annual ACM IEEE Design Automation Conference, DAC 2016 - Austin, United States
Duration: Jun 5 2016Jun 9 2016

Publication series

NameProceedings - Design Automation Conference
Volume05-09-June-2016
ISSN (Print)0738-100X

Other

Other53rd Annual ACM IEEE Design Automation Conference, DAC 2016
CountryUnited States
CityAustin
Period6/5/166/9/16

Keywords

  • Blech length
  • Electromigration
  • Steady state
  • Stress

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