Polymer shrinkage of hot embossed microstructures for higher aspect ratio and smaller size

Xuelin Zhu, Tianhong Cui

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

In this paper, a facile polymer fabrication approach by combination of hot embossing and polymer shrinking is presented to reduce the feature size and dramatically increase the aspect ratio of imprinted microstructures. Pre-pattern is hot embossed on a heat shrinkable polymer at low temperature to reserve a good shrinkage and recovery. The projected structures are removed by a polishing process. Finally, new microstructures derive from the pre-pattern at the absence of removed materials after baking process. Through this way, both two- and three-dimensional hot embossed structures were successfully shrunk into a smaller scale. The width along two lateral directions reduced to two-fifths, and the height along vertical direction increased by 6 times. Detailed features at different layers exhibit clearly three-dimensional shrunk microstructures. This polymer-shrinking process brings a new way to extend the fabrication capability of hot embossing process.

Original languageEnglish (US)
Pages (from-to)21-26
Number of pages6
JournalSensors and Actuators, A: Physical
Volume195
DOIs
StatePublished - Apr 2 2013

Fingerprint

high aspect ratio
shrinkage
Aspect ratio
Polymers
embossing
microstructure
Microstructure
polymers
Fabrication
fabrication
baking
Polishing
polishing
aspect ratio
recovery
Recovery
heat
Temperature
Direction compound

Keywords

  • Hot embossing
  • MEMS
  • Microstructure
  • Shrinkable polymer

Cite this

Polymer shrinkage of hot embossed microstructures for higher aspect ratio and smaller size. / Zhu, Xuelin; Cui, Tianhong.

In: Sensors and Actuators, A: Physical, Vol. 195, 02.04.2013, p. 21-26.

Research output: Contribution to journalArticle

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