Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics

Yong Hua Zhang, Stephen A. Campbell, Liyuan Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Flexible electronics has gained increasing attention for biomedical engineering applications, solar cell and so on. In this paper, an SU-8/silicon(100)/SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the underneath thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by a finite element (FE) simulation utilizing ANSYS software. Using plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etching mask, a 4" silicon(100) wafer was thinned to 26μm without rupture in a 30 wt.% KOH solution. The thinned wafer was coated on both sides with 20μm of SU-8 photoresist and cut into strips. And then the strips were bent by a caliper to measure its radius of curvature. A sector model of bending deformation was adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3mm. The polymer-sandwiched ultra-thin silicon(100) layer can be used as a flexible substrate. And the fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. It can be used as a post-fabrication process for high performance flexible electronics.

Original languageEnglish (US)
Title of host publicationProceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015
EditorsZhiyong Tao, Li Bai, Sen Lin, Jinguang Sun, Lipo Wang, Liangshan Shao
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages366-370
Number of pages5
ISBN (Electronic)9781509000227
DOIs
StatePublished - Feb 8 2016
Event8th International Conference on BioMedical Engineering and Informatics, BMEI 2015 - Shenyang, China
Duration: Oct 14 2015Oct 16 2015

Other

Other8th International Conference on BioMedical Engineering and Informatics, BMEI 2015
CountryChina
CityShenyang
Period10/14/1510/16/15

Fingerprint

Flexible electronics
Silicon
Polymers
Sandwich structures
Photoresists
Fabrication
Membranes
Biomedical engineering
Biomedical Engineering
Composite films
Silicon wafers
Corrosion
Microelectronics
Masks
Etching
Solar cells
Vapors
Rupture
Plasmas
Software

Keywords

  • SU-8 photoresist
  • bulk silicon (100)
  • flexible electronic technology
  • micro-electro-mechanical systems
  • sandwich structure

Cite this

Zhang, Y. H., Campbell, S. A., & Zhang, L. (2016). Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. In Z. Tao, L. Bai, S. Lin, J. Sun, L. Wang, & L. Shao (Eds.), Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015 (pp. 366-370). [7401531] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/BMEI.2015.7401531

Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. / Zhang, Yong Hua; Campbell, Stephen A.; Zhang, Liyuan.

Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015. ed. / Zhiyong Tao; Li Bai; Sen Lin; Jinguang Sun; Lipo Wang; Liangshan Shao. Institute of Electrical and Electronics Engineers Inc., 2016. p. 366-370 7401531.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhang, YH, Campbell, SA & Zhang, L 2016, Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. in Z Tao, L Bai, S Lin, J Sun, L Wang & L Shao (eds), Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015., 7401531, Institute of Electrical and Electronics Engineers Inc., pp. 366-370, 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015, Shenyang, China, 10/14/15. https://doi.org/10.1109/BMEI.2015.7401531
Zhang YH, Campbell SA, Zhang L. Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. In Tao Z, Bai L, Lin S, Sun J, Wang L, Shao L, editors, Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015. Institute of Electrical and Electronics Engineers Inc. 2016. p. 366-370. 7401531 https://doi.org/10.1109/BMEI.2015.7401531
Zhang, Yong Hua ; Campbell, Stephen A. ; Zhang, Liyuan. / Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015. editor / Zhiyong Tao ; Li Bai ; Sen Lin ; Jinguang Sun ; Lipo Wang ; Liangshan Shao. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 366-370
@inproceedings{dcb9cb4b83ec423e9985d2ac58edb528,
title = "Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics",
abstract = "Flexible electronics has gained increasing attention for biomedical engineering applications, solar cell and so on. In this paper, an SU-8/silicon(100)/SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the underneath thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by a finite element (FE) simulation utilizing ANSYS software. Using plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etching mask, a 4{"} silicon(100) wafer was thinned to 26μm without rupture in a 30 wt.{\%} KOH solution. The thinned wafer was coated on both sides with 20μm of SU-8 photoresist and cut into strips. And then the strips were bent by a caliper to measure its radius of curvature. A sector model of bending deformation was adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3mm. The polymer-sandwiched ultra-thin silicon(100) layer can be used as a flexible substrate. And the fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. It can be used as a post-fabrication process for high performance flexible electronics.",
keywords = "SU-8 photoresist, bulk silicon (100), flexible electronic technology, micro-electro-mechanical systems, sandwich structure",
author = "Zhang, {Yong Hua} and Campbell, {Stephen A.} and Liyuan Zhang",
year = "2016",
month = "2",
day = "8",
doi = "10.1109/BMEI.2015.7401531",
language = "English (US)",
pages = "366--370",
editor = "Zhiyong Tao and Li Bai and Sen Lin and Jinguang Sun and Lipo Wang and Liangshan Shao",
booktitle = "Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics

AU - Zhang, Yong Hua

AU - Campbell, Stephen A.

AU - Zhang, Liyuan

PY - 2016/2/8

Y1 - 2016/2/8

N2 - Flexible electronics has gained increasing attention for biomedical engineering applications, solar cell and so on. In this paper, an SU-8/silicon(100)/SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the underneath thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by a finite element (FE) simulation utilizing ANSYS software. Using plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etching mask, a 4" silicon(100) wafer was thinned to 26μm without rupture in a 30 wt.% KOH solution. The thinned wafer was coated on both sides with 20μm of SU-8 photoresist and cut into strips. And then the strips were bent by a caliper to measure its radius of curvature. A sector model of bending deformation was adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3mm. The polymer-sandwiched ultra-thin silicon(100) layer can be used as a flexible substrate. And the fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. It can be used as a post-fabrication process for high performance flexible electronics.

AB - Flexible electronics has gained increasing attention for biomedical engineering applications, solar cell and so on. In this paper, an SU-8/silicon(100)/SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the underneath thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by a finite element (FE) simulation utilizing ANSYS software. Using plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etching mask, a 4" silicon(100) wafer was thinned to 26μm without rupture in a 30 wt.% KOH solution. The thinned wafer was coated on both sides with 20μm of SU-8 photoresist and cut into strips. And then the strips were bent by a caliper to measure its radius of curvature. A sector model of bending deformation was adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3mm. The polymer-sandwiched ultra-thin silicon(100) layer can be used as a flexible substrate. And the fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. It can be used as a post-fabrication process for high performance flexible electronics.

KW - SU-8 photoresist

KW - bulk silicon (100)

KW - flexible electronic technology

KW - micro-electro-mechanical systems

KW - sandwich structure

UR - http://www.scopus.com/inward/record.url?scp=84964344942&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84964344942&partnerID=8YFLogxK

U2 - 10.1109/BMEI.2015.7401531

DO - 10.1109/BMEI.2015.7401531

M3 - Conference contribution

SP - 366

EP - 370

BT - Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015

A2 - Tao, Zhiyong

A2 - Bai, Li

A2 - Lin, Sen

A2 - Sun, Jinguang

A2 - Wang, Lipo

A2 - Shao, Liangshan

PB - Institute of Electrical and Electronics Engineers Inc.

ER -