Polymer based Acoustic Wave Sensor Using Hot Embossing Technique

Jungyoon Kim; Tianyi Zhang; Quan Guan; John Sartori; Lauren Linderman; Vuk Mandic; Tianhong Cui

doi:10.1109/transducers50396.2021.9495735

Polymer based Acoustic Wave Sensor Using Hot Embossing Technique

Jungyoon Kim
, Tianyi Zhang
, Quan Guan
, John Sartori
, Lauren Linderman
, Vuk Mandic
, Tianhong Cui

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

The objective of this research is to develop a highly sensitive acoustic wave sensor using a tunneling current. The tunneling current device is fabricated with the hot embossing technology. Since polymethyl methacrylate (PMMA) is less expensive, has little stiffness, and is easier to work with micro-machining process compared to traditional silicon-based tunneling sensors, we fabricate the tip structure on the material using the hot embossing process. First, the frequency response of the tunneling device is measured by a piezoelectric transducer (PZT) and laser vibrometer to find the resonance frequency. Then the performance of the device is characterized by measuring the acoustic wave, which has the resonance frequency.

Original language	English (US)
Title of host publication	21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1275-1278
Number of pages	4
ISBN (Electronic)	9781665412674
DOIs	https://doi.org/10.1109/transducers50396.2021.9495735
State	Published - Jun 20 2021
Event	21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 - Virtual, Online, United States Duration: Jun 20 2021 → Jun 25 2021

Publication series

Name	21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021

Conference

Conference	21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Country/Territory	United States
City	Virtual, Online
Period	6/20/21 → 6/25/21

Bibliographical note

Funding Information:
This work is supported by MnDRIVE—Minnesota’s Discovery, Research, and InnoVation Economy.

Funding Information:
The authors acknowledge the fabrication and characterization assistance provided by the Minnesota Nano Center and the Characterization Facility at the University of Minnesota.

Publisher Copyright:
© 2021 IEEE.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Acoustic wave
Hot embossing
PMMA
PZT
Tunneling current

Publisher link

10.1109/transducers50396.2021.9495735

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Cite this

Kim, J., Zhang, T., Guan, Q., Sartori, J., Linderman, L., Mandic, V., & Cui, T. (2021). Polymer based Acoustic Wave Sensor Using Hot Embossing Technique. In 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 (pp. 1275-1278). (21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/transducers50396.2021.9495735

Polymer based Acoustic Wave Sensor Using Hot Embossing Technique. / Kim, Jungyoon; Zhang, Tianyi; Guan, Quan et al.
21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 1275-1278 (21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kim, J, Zhang, T, Guan, Q, Sartori, J , Linderman, L , Mandic, V & Cui, T 2021, Polymer based Acoustic Wave Sensor Using Hot Embossing Technique. in 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021. 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021, Institute of Electrical and Electronics Engineers Inc., pp. 1275-1278, 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021, Virtual, Online, United States, 6/20/21. https://doi.org/10.1109/transducers50396.2021.9495735

Kim J, Zhang T, Guan Q, Sartori J , Linderman L , Mandic V et al. Polymer based Acoustic Wave Sensor Using Hot Embossing Technique. In 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 1275-1278. (21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021). doi: 10.1109/transducers50396.2021.9495735

Kim, Jungyoon ; Zhang, Tianyi ; Guan, Quan et al. / Polymer based Acoustic Wave Sensor Using Hot Embossing Technique. 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 1275-1278 (21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021).

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AB - The objective of this research is to develop a highly sensitive acoustic wave sensor using a tunneling current. The tunneling current device is fabricated with the hot embossing technology. Since polymethyl methacrylate (PMMA) is less expensive, has little stiffness, and is easier to work with micro-machining process compared to traditional silicon-based tunneling sensors, we fabricate the tip structure on the material using the hot embossing process. First, the frequency response of the tunneling device is measured by a piezoelectric transducer (PZT) and laser vibrometer to find the resonance frequency. Then the performance of the device is characterized by measuring the acoustic wave, which has the resonance frequency.

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KW - Hot embossing

KW - PMMA

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Polymer based Acoustic Wave Sensor Using Hot Embossing Technique

Abstract

Publication series

Conference

Bibliographical note

UN SDGs

Keywords

Publisher link

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