Placement optimization of power supply pads based on locality

Pingqiang Zhou, Vivek Mishra, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

This paper presents an efficient algorithm for the placement of power supply pads in flip-chip packaging for high-performance VLSI circuits. The placement problem is formulated as a mixed-integer linear program (MILP), subject to the constraints on mean-time-to-failure (MTTF) for the pads and the voltage drop in the power grid. To improve the performance of the optimizer, the pad placement problem is solved based on the divide-and-conquer principle, and the locality properties of the power grid are exploited by modeling the distant nodes and sources coarsely, following the coarsening stage in multigrid-like approach. An accurate electromigration (EM) model that captures current crowding and Joule heating effects is developed and integrated with our C4 placement approach. The effectiveness of the proposed approach is demonstrated on several designs adapted from publicly released benchmarks.

Original languageEnglish (US)
Title of host publicationProceedings - Design, Automation and Test in Europe, DATE 2013
Pages1655-1660
Number of pages6
StatePublished - Oct 21 2013
Event16th Design, Automation and Test in Europe Conference and Exhibition, DATE 2013 - Grenoble, France
Duration: Mar 18 2013Mar 22 2013

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591

Other

Other16th Design, Automation and Test in Europe Conference and Exhibition, DATE 2013
CountryFrance
CityGrenoble
Period3/18/133/22/13

Fingerprint Dive into the research topics of 'Placement optimization of power supply pads based on locality'. Together they form a unique fingerprint.

Cite this