TY - GEN
T1 - Placement optimization of power supply pads based on locality
AU - Zhou, Pingqiang
AU - Mishra, Vivek
AU - Sapatnekar, Sachin S.
PY - 2013
Y1 - 2013
N2 - This paper presents an efficient algorithm for the placement of power supply pads in flip-chip packaging for high-performance VLSI circuits. The placement problem is formulated as a mixed-integer linear program (MILP), subject to the constraints on mean-time-to-failure (MTTF) for the pads and the voltage drop in the power grid. To improve the performance of the optimizer, the pad placement problem is solved based on the divide-and-conquer principle, and the locality properties of the power grid are exploited by modeling the distant nodes and sources coarsely, following the coarsening stage in multigrid-like approach. An accurate electromigration (EM) model that captures current crowding and Joule heating effects is developed and integrated with our C4 placement approach. The effectiveness of the proposed approach is demonstrated on several designs adapted from publicly released benchmarks.
AB - This paper presents an efficient algorithm for the placement of power supply pads in flip-chip packaging for high-performance VLSI circuits. The placement problem is formulated as a mixed-integer linear program (MILP), subject to the constraints on mean-time-to-failure (MTTF) for the pads and the voltage drop in the power grid. To improve the performance of the optimizer, the pad placement problem is solved based on the divide-and-conquer principle, and the locality properties of the power grid are exploited by modeling the distant nodes and sources coarsely, following the coarsening stage in multigrid-like approach. An accurate electromigration (EM) model that captures current crowding and Joule heating effects is developed and integrated with our C4 placement approach. The effectiveness of the proposed approach is demonstrated on several designs adapted from publicly released benchmarks.
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U2 - 10.7873/date.2013.335
DO - 10.7873/date.2013.335
M3 - Conference contribution
AN - SCOPUS:84885662471
SN - 9783981537000
T3 - Proceedings -Design, Automation and Test in Europe, DATE
SP - 1655
EP - 1660
BT - Proceedings - Design, Automation and Test in Europe, DATE 2013
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th Design, Automation and Test in Europe Conference and Exhibition, DATE 2013
Y2 - 18 March 2013 through 22 March 2013
ER -