Placement of 3D ICs with thermal and interlayer via considerations

Brent Goplen, Sachin Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

94 Scopus citations


Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during global and detailed placement. Analytical and partitioning-based techniques are developed to explore the tradeoff between wirelength, interlayer via counts, and thermal effects. This method allows wirelengths to be minimized for any desired interlayer via density and temperatures to be reduced while minimizing deleterious effects on wirelength and interlayer via counts. Wirelength reductions within 2% of the optimal can be achieved using 46% fewer interlayer vias. Temperatures can be reduced by about 20% with only 1% higher wirelengths and 10% more interlayer vias.

Original languageEnglish (US)
Title of host publication2007 44th ACM/IEEE Design Automation Conference, DAC'07
Number of pages6
StatePublished - 2007
Event2007 44th ACM/IEEE Design Automation Conference, DAC'07 - San Diego, CA, United States
Duration: Jun 4 2007Jun 8 2007

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X


Other2007 44th ACM/IEEE Design Automation Conference, DAC'07
Country/TerritoryUnited States
CitySan Diego, CA


  • 3-D IC
  • 3-D VLSI
  • Interlayer vias
  • Placement
  • Temperature
  • Thermal optimization


Dive into the research topics of 'Placement of 3D ICs with thermal and interlayer via considerations'. Together they form a unique fingerprint.

Cite this