Pattern Transfer of Sub-10 nm Features via Tin-Containing Block Copolymers

  • Michael J. Maher
  • , Kazunori Mori
  • , Stephen M. Sirard
  • , Andrew M. Dinhobl
  • , Christopher M. Bates
  • , Emir Gurer
  • , Gregory Blachut
  • , Austin P. Lane
  • , William J. Durand
  • , Matthew C. Carlson
  • , Jeffrey R. Strahan
  • , Christopher J. Ellison
  • , C. Grant Willson

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

Tin-containing block copolymers were investigated as materials for nanolithographic applications. Poly(4-trimethylstannylstyrene-block-styrene) (PSnS-PS) and poly(4-trimethylstannylstyrene-block-4-methoxystyrene) (PSnS-PMOST) synthesized by reversible addition-fragmentation chain transfer polymerization form lamellar domains with periodicities ranging from 18 to 34 nm. Thin film orientation control was achieved by thermal annealing between a neutral surface treatment and a top coat. Incorporation of tin into one block facilitates pattern transfer into SiO2 via a two-step etch process utilizing oxidative and fluorine-based etch chemistries. (Figure Presented).

Original languageEnglish (US)
Pages (from-to)391-395
Number of pages5
JournalACS Macro Letters
Volume5
Issue number3
DOIs
StatePublished - Mar 15 2016

Bibliographical note

Publisher Copyright:
© 2016 American Chemical Society.

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