Particle removal from semiconductor wafers by megasonic cleaning

Engineering

• Semiconductor 100%
• Acoustics 100%
• Cleaning 100%
• Control Surfaces 100%
• Surfaces 50%
• Obtains 50%
• Fluid 50%
• Transmissions 50%
• Sound Source 50%
• Silicon Wafer 50%
• Velocity Field 50%
• Semiconductor Manufacturing 50%
• Infinite Medium 50%
• Pressure Field 50%
• Integration Method 50%
• Ray Method 50%
• Acoustic Energy 50%
• Acoustic Field 50%
• Sound Pressure 50%

Physics

• Acoustics 100%
• Particle 100%
• Semiconductor 100%
• Cleaning 100%
• Wafer 100%
• Control Surfaces 66%
• Frequencies 33%
• Media 33%
• Liquids 33%
• Position (Location) 33%
• Mathematical Model 33%
• Silicon 33%
• Speed 33%
• Pressure Distribution 33%
• Acoustic Streaming 33%
• Geometrical Acoustic 33%
• Sound Pressure 33%