Particle removal from semiconductor wafers by megasonic cleaning

T. H. Kuehn, D. B. Kittelson, Y. Wu, R. Gouk

Research output: Contribution to journalConference articlepeer-review

27 Scopus citations

Abstract

Particle removal from silicon wafers by cleaning the wafers in a liquid tank with an acoustic field at a frequency near 1 megahertz during semiconductor manufacturing is investigated. Two modelling techniques used to obtain the sound pressure field and the acoustic streaming velocity field in the tank are compared. The component integration method integrates the contributions from each control surface on the sound source to each location of interest in the fluid. The acoustic ray method uses acoustic energy bundles emitted isotropically from each control surface on the source. Results from both methods can handle partial reflection/transmission at surfaces and compare well to published solutions in semi-infinite media and to experimental data.

Original languageEnglish (US)
Pages (from-to)S427-S428
JournalJournal of Aerosol Science
Volume27
Issue numberSuppl 1
DOIs
StatePublished - Jan 1 1996
EventProceedings of the 1996 European Aerosol Conference - Delft, Neth
Duration: Sep 9 1996Sep 12 1996

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