Particle removal from silicon wafers by cleaning the wafers in a liquid tank with an acoustic field at a frequency near 1 megahertz during semiconductor manufacturing is investigated. Two modelling techniques used to obtain the sound pressure field and the acoustic streaming velocity field in the tank are compared. The component integration method integrates the contributions from each control surface on the sound source to each location of interest in the fluid. The acoustic ray method uses acoustic energy bundles emitted isotropically from each control surface on the source. Results from both methods can handle partial reflection/transmission at surfaces and compare well to published solutions in semi-infinite media and to experimental data.
|Original language||English (US)|
|Journal||Journal of Aerosol Science|
|Issue number||Suppl 1|
|State||Published - Jan 1 1996|
|Event||Proceedings of the 1996 European Aerosol Conference - Delft, Neth|
Duration: Sep 9 1996 → Sep 12 1996