Packed food and packaging materials disinfected by cold plasma

Peng Peng, Paul Chen, Nan Zhou, Charles Schiappacasse, Yanling Cheng, Dongjie Chen, Min Addy, Yaning Zhang, Erik Anderson, Liangliang Fan, Raymond Hatzenbeller, Yuhuan Liu, R. R Ruan

Research output: Chapter in Book/Report/Conference proceedingChapter

10 Scopus citations

Abstract

This chapter aims to introduce the applications and recent developments of using cold plasma for the decontamination and sterilization of packaged foods and food packaging materials, respectively. Decontamination of packaged foods and food packaging sterilization are crucial processes to ensuring the success of the food industry and the safety of the industry’s consumers. In these applications, cold plasma acts as a final decontamination treatment may be an effective means of removing pesticides from fresh produce products and their packaging materials. For decontamination of packed food, the dielectric barrier discharge (DBD) plasma has been widely used. For food packaging sterilization, this chapter classifies the studies into two categories, the direct and indirect treatments. Cold plasma has led to satisfying results in decontamination in-packaged foods (mostly fresh produce) and sterilization of food packaging materials. Future research could be directed to the disinfection of a broader range of in-package foods and food packages made from the novel biodegradable polymers.

Original languageEnglish (US)
Title of host publicationAdvances in Cold Plasma Applications for Food Safety and Preservation
PublisherElsevier
Pages269-286
Number of pages18
ISBN (Electronic)9780128149218
ISBN (Print)9780128149225
DOIs
StatePublished - Jan 1 2019

Keywords

  • Cold plasma
  • Direct and in-direct sterilization
  • Food packaging sterilization
  • Microbial resistance
  • Non-thermal sterilization
  • Packed food sterilization

Fingerprint

Dive into the research topics of 'Packed food and packaging materials disinfected by cold plasma'. Together they form a unique fingerprint.

Cite this