Origin of thermal stability in laminated antiferromagnetically coupled media

S. N. Piramanayagam, Ching Hian Hee, S. I. Pang, J. P. Wang

Research output: Contribution to journalConference articlepeer-review

Abstract

The origin of thermal stability in laminated antiferromagnetically coupled media was investigated. A series of films were prepared to understand the role of top layer, bottom layer parameters and the antiferromagnetic coupling constant. Thermal stability factor (SF) was estimated from Sharrock's equation. SF showed an increase as a function of bottom layer thickness, indicating that the thermal stability depends on the thickness of bottom layer.

Original languageEnglish (US)
Pages (from-to)FP02
JournalDigests of the Intermag Conference
StatePublished - Dec 1 2002
Event2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG - Amsterdam, Netherlands
Duration: Apr 28 2002May 2 2002

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