Origin of thermal stability in laminated antiferromagnetically coupled media

S. N. Piramanayagam; Ching Hian Hee; S. I. Pang; J. P. Wang

Origin of thermal stability in laminated antiferromagnetically coupled media

S. N. Piramanayagam, Ching Hian Hee, S. I. Pang, J. P. Wang

Electrical and Computer Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

The origin of thermal stability in laminated antiferromagnetically coupled media was investigated. A series of films were prepared to understand the role of top layer, bottom layer parameters and the antiferromagnetic coupling constant. Thermal stability factor (SF) was estimated from Sharrock's equation. SF showed an increase as a function of bottom layer thickness, indicating that the thermal stability depends on the thickness of bottom layer.

Original language	English (US)
Pages (from-to)	FP02
Journal	Digests of the Intermag Conference
State	Published - 2002
Event	2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG - Amsterdam, Netherlands Duration: Apr 28 2002 → May 2 2002

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title = "Origin of thermal stability in laminated antiferromagnetically coupled media",

abstract = "The origin of thermal stability in laminated antiferromagnetically coupled media was investigated. A series of films were prepared to understand the role of top layer, bottom layer parameters and the antiferromagnetic coupling constant. Thermal stability factor (SF) was estimated from Sharrock's equation. SF showed an increase as a function of bottom layer thickness, indicating that the thermal stability depends on the thickness of bottom layer.",

author = "Piramanayagam, {S. N.} and Hee, {Ching Hian} and Pang, {S. I.} and Wang, {J. P.}",

year = "2002",

language = "English (US)",

pages = "FP02",

journal = "Digests of the Intermag Conference",

issn = "0074-6843",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG ; Conference date: 28-04-2002 Through 02-05-2002",

}

TY - JOUR

T1 - Origin of thermal stability in laminated antiferromagnetically coupled media

AU - Piramanayagam, S. N.

AU - Hee, Ching Hian

AU - Pang, S. I.

AU - Wang, J. P.

PY - 2002

Y1 - 2002

N2 - The origin of thermal stability in laminated antiferromagnetically coupled media was investigated. A series of films were prepared to understand the role of top layer, bottom layer parameters and the antiferromagnetic coupling constant. Thermal stability factor (SF) was estimated from Sharrock's equation. SF showed an increase as a function of bottom layer thickness, indicating that the thermal stability depends on the thickness of bottom layer.

AB - The origin of thermal stability in laminated antiferromagnetically coupled media was investigated. A series of films were prepared to understand the role of top layer, bottom layer parameters and the antiferromagnetic coupling constant. Thermal stability factor (SF) was estimated from Sharrock's equation. SF showed an increase as a function of bottom layer thickness, indicating that the thermal stability depends on the thickness of bottom layer.

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UR - http://www.scopus.com/inward/citedby.url?scp=18244423737&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:18244423737

SN - 0074-6843

SP - FP02

JO - Digests of the Intermag Conference

JF - Digests of the Intermag Conference

T2 - 2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG

Y2 - 28 April 2002 through 2 May 2002

ER -

Origin of thermal stability in laminated antiferromagnetically coupled media

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