TY - JOUR
T1 - Optical micromachined ultrasound transducers (OMUT)-a new approach for high-frequency transducers
AU - Tadayon, Mohammad Amin
AU - Ashkenazi, Shai
PY - 2013
Y1 - 2013
N2 - The sensitivity and reliability of piezoelectric ultrasound transducers severely degrade in applications requiring high frequency and small element size. Alternative technologies such as capacitive micromachined ultrasound transducers (CMUT) and optical sensing and generation of ultrasound have been proposed and studied for several decades. In this paper, we present a new type of device based on optical micromachined ultrasound transducer (OMUT) technology. OMUTs rely on microfabrication techniques to construct micrometerscale air cavities capped by an elastic membrane. A modified photoresist bonding process has been developed to facilitate the fabrication of these devices. We will describe the design, fabrication, and testing of prototype OMUT devices which implement a receive-only function. Future design modifications are proposed for incorporating complete transmit-receive functionality in a single element.
AB - The sensitivity and reliability of piezoelectric ultrasound transducers severely degrade in applications requiring high frequency and small element size. Alternative technologies such as capacitive micromachined ultrasound transducers (CMUT) and optical sensing and generation of ultrasound have been proposed and studied for several decades. In this paper, we present a new type of device based on optical micromachined ultrasound transducer (OMUT) technology. OMUTs rely on microfabrication techniques to construct micrometerscale air cavities capped by an elastic membrane. A modified photoresist bonding process has been developed to facilitate the fabrication of these devices. We will describe the design, fabrication, and testing of prototype OMUT devices which implement a receive-only function. Future design modifications are proposed for incorporating complete transmit-receive functionality in a single element.
UR - http://www.scopus.com/inward/record.url?scp=84883793283&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84883793283&partnerID=8YFLogxK
U2 - 10.1109/TUFFC.2013.2787
DO - 10.1109/TUFFC.2013.2787
M3 - Article
C2 - 24658733
AN - SCOPUS:84883793283
SN - 0885-3010
VL - 60
SP - 2021
EP - 2030
JO - IRE Transactions on Ultrasonic Engineering
JF - IRE Transactions on Ultrasonic Engineering
IS - 9
M1 - 6587411
ER -