On Wafer-Packing Problems

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Abstract

Wafer packing is a process of combining multiple chip designs on the same water such that the fabrication cost can be shared by several designs and hence reduced. This technique is widely used for designs that require a small number of dies or chips. It is essential to have computer algorithms to decide how to allocate designs to wafers in order to reduce the total fabrication cost. Based on different wafer fabrication techniques, two versions of the wafer packing problem are formulated. We study different variations for each version. We present algorithms to find optimal solutions for these variations which are polynomial-time solvable. We also present heuristic algorithms for those proven to be NP-hard. The effectiveness of the proposed algorithms is demonstrated by experimental results.

Original languageEnglish (US)
Pages (from-to)1382-1388
Number of pages7
JournalIEEE Transactions on Computers
Volume42
Issue number11
DOIs
StatePublished - Nov 1993

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