ON THREE LAYER VIA MINIMIZATION.

K. C. Chang; H. C. Du

ON THREE LAYER VIA MINIMIZATION.

K. C. Chang
, H. C. Du

Computer Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The via minimization problem for a three-layer environment is studied, concentrating on the constrained via minimization (CVM3) problem. It is shown that the CVM3 problem is NP-complete, and a heuristic algorithm is proposed. The experimental results show that the algorithm is efficient and generates fairly good solutions.

Original language	English (US)
Title of host publication	Unknown Host Publication Title
Publisher	IEEE
Pages	274-277
Number of pages	4
ISBN (Print)	0818608021
State	Published - 1987

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title = "ON THREE LAYER VIA MINIMIZATION.",

abstract = "The via minimization problem for a three-layer environment is studied, concentrating on the constrained via minimization (CVM3) problem. It is shown that the CVM3 problem is NP-complete, and a heuristic algorithm is proposed. The experimental results show that the algorithm is efficient and generates fairly good solutions.",

author = "Chang, \{K. C.\} and Du, \{H. C.\}",

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publisher = "IEEE",

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AU - Du, H. C.

PY - 1987

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N2 - The via minimization problem for a three-layer environment is studied, concentrating on the constrained via minimization (CVM3) problem. It is shown that the CVM3 problem is NP-complete, and a heuristic algorithm is proposed. The experimental results show that the algorithm is efficient and generates fairly good solutions.

AB - The via minimization problem for a three-layer environment is studied, concentrating on the constrained via minimization (CVM3) problem. It is shown that the CVM3 problem is NP-complete, and a heuristic algorithm is proposed. The experimental results show that the algorithm is efficient and generates fairly good solutions.

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M3 - Conference contribution

AN - SCOPUS:0023558883

SN - 0818608021

SP - 274

EP - 277

BT - Unknown Host Publication Title

PB - IEEE

ER -

ON THREE LAYER VIA MINIMIZATION.

Abstract

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