Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited)

Keyphrases

• Electromigration 100%
• Experimental Validation 100%
• On-chip Power Grid 100%
• Novel Methodology 100%
• Temperature Sensing 100%
• Simulation Validation 100%
• Integrated Circuits 50%
• Power Grid 50%
• Failure Criterion 50%
• Simulation Approach 50%
• Temperature Distribution 50%
• Temperature Gradient 50%
• Diffusivity 50%
• Metal Structure 50%
• Random Distribution 50%
• Thermal Stress 50%
• Critical Stress 50%
• Failure Time 50%
• Mean Time to Failure 50%
• Resistance Increase 50%
• Non-uniform Temperature Distribution 50%
• Power Ground 50%
• Atomic Flux 50%
• Test Power 50%
• Cathode Voltage Drop 50%
• IR Drop 50%
• Node Voltage 50%
• Void nucleation 50%
• Failure Assessment 50%
• Time-to-failure Distribution 50%
• Compact Model 50%
• FEM Simulation 50%

Engineering

• Electromigration 100%
• Power Grid 100%
• Interconnects 100%
• Temperature Distribution 100%
• Failure Criterion 50%
• Good Agreement 50%
• Voltage Drop 50%
• Critical Stress 50%
• Thermal Stress 50%
• Node Voltage 50%
• Atomic Flux 50%
• Statistical Distribution 50%
• Mean Time to Failure 50%
• Cathode Voltage 50%
• Integrated Circuit 50%
• Thermal Gradient 50%
• Temperature Gradients 50%
• Atomic Diffusion 50%