Novel lithography-based approaches to pattern layer-by-layer self-assembled thin films

Tianhong Cui, Yuri Lvov, Feng Hua, Jingshi Shi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Layer-by-layer self-assembly is a key enabling technique in nanotechnology. It is very crucial to pattern the self-assembled thin films for the realization of nano/microelectronics devices or NEMS (Nano Electro Mechanical Systems). Two approaches to generate spatially separated patterns comprised of organic or inorganic nanoparticles are demonstrated. The processes are based on the lithographic patterning of the nanoparticle-based thin films which are layer-by-layer assembled. This opens to industrial applications of popular layer-by-layer method to produce multilayers for polymers, nanoparticles and protein organized in nanometer scale. These two methods are referred to by us as "lift-off" and "metal mask", respectively. Sharp and clear patterns are created with both methods and images are recorded by scanning electron microscope. Their advantages and disadvantages are discussed and potential usage in 3-D nanostructure fabrication is investigated. In addition, temperature-dependent experiment has first been carried out to make this techniques more practical for micro/naoelectronics or NEMS devices.

Original languageEnglish (US)
Title of host publicationMicroelectromechanical Systems
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages603-610
Number of pages8
ISBN (Print)0791836428, 9780791836422
DOIs
StatePublished - Jan 1 2002

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings

Keywords

  • Lift-off
  • Lithography
  • Metal-mask
  • Patterning
  • Self-assembly

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