Novel integration technique for flip-chip bonding circuit in wafer scale packaging

Keyphrases

• Wafer-level Packaging 100%
• Integration Techniques 100%
• Flip-chip Bonding 100%
• Soldering 66%
• Performance Improvement 33%
• Metal Bond 33%
• Transition Region 33%
• Coplanar Waveguide 33%
• Effective Dielectric Constant 33%
• Multilayered Structure 33%
• Bonding Process 33%
• Flip-chip Interconnect 33%
• Flip chip 33%
• Bond Pad 33%
• Flip chip Structure 33%
• Wideband Transition 33%
• Transition Part 33%

Engineering

• Chip Bonding 100%
• Dielectrics 50%
• Waveguide 50%
• Performance Improvement 50%
• Interconnects 50%
• Bonding Process 50%
• Band Transition 50%