Novel integration technique for flip-chip bonding circuit in wafer scale packaging

Young Seek Cho, Rhonda Franklin Drayton

Research output: Contribution to journalConference articlepeer-review

4 Scopus citations


A novel integration technique for flip-chip bonding a circuit in wafer scale packaging is presented. The solder is a multilayered structure which consists of 95 at.% Sn and 5 at.% Au. The metal-to-metal bonding process was carried out around 230°C in air. The solder bond pads have an area of 625μm2 with the height of 2.3μm. To characterize the integration technique a variety of designs for a flip-chip interconnections are fabricated and measured for a flip-chip mounted coplanar waveguide(CPW). Modeled predictions of the design show significant performance improvement can be achieved by considering the impact of the substrate and associated parasitics on the mounted chip and transition region in the design. In this paper, we discuss design, modeling and measurement of wide band transition for flip chipped circuits in wafer scale packaging. A locally scaled flip-chip structure is proposed to compensate effective dielectric constant at the transition part of the interconnect.

Original languageEnglish (US)
Article number1710451
Pages (from-to)57-60
Number of pages4
JournalIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
StatePublished - 2006
EventIEEE Antennas and Propagation Society International Symposium, APS 2006 - Albuquerque, NM, United States
Duration: Jul 9 2006Jul 14 2006


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