Novel CMOS low-loss transmission line structure

Jaewon Kim, Byunghoo Jung, Philip Cheung, Ramesh Harjani

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Scopus citations

Abstract

As operating speeds increase low-loss interconnect structures such as transmission lines become critical in the design of RF and high speed digital circuits. This paper presents a novel low-loss transmission line structure. We discuss the importance of transmission line structures, including coplanar and grounded coplanar structures. Grounded coplanar waveguide (GCPW) structures are enhanced to reduce the substrate loss. The primary goal of new interconnect topology, stacked GCPW (S-GCPW), is to reduce the loss by shaping the electric fields under the signal line. 3D electromagnetic wave simulations are used to verify the efficacy of the new transmission line structures. The insertion loss for a 4mm long S-GCPW structure is 1.62dB@50GHz (0.41dB/mm) while the insertion loss for a 4mm long traditional GCPW structure is 3.28dB (0.82dB/mm) hi a 0.12μm SOI CMOS technology.

Original languageEnglish (US)
Title of host publicationProceedings - 2004 IEEE Radio and Wireless Conference, RAWCON
EditorsG. Heiter
Pages235-238
Number of pages4
StatePublished - Dec 1 2004
EventProceedings - 2004 IEEE Radio and Wireless Conference, RAWCON - Atlanta, GA, United States
Duration: Sep 19 2004Sep 22 2004

Publication series

NameProceedings - 2004 IEEE Radio and Wireless Conference, RAWCON

Other

OtherProceedings - 2004 IEEE Radio and Wireless Conference, RAWCON
CountryUnited States
CityAtlanta, GA
Period9/19/049/22/04

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