TY - GEN
T1 - New 3-level submodules for a modular multilevel converter based HVDC system with advanced features
AU - Sahoo, Ashish Kumar
AU - Otero-De-Leon, Ruben
AU - Chandrasekaran, Visweshwar
AU - Mohan, Ned
PY - 2013
Y1 - 2013
N2 - Modular multilevel converters have emerged as a viable solution over conventional voltage source converters (VSC) for applications in high voltage direct current (HVDC) transmission. Due to modular structure, the converter can reach high number of voltage levels resulting in low switching frequency and near sinusoidal voltage waveforms. This paper proposes new submodule topologies which can result in even higher voltage levels with reduced voltage stress across some switches and lower semiconductor losses. A modified modulation scheme and voltage balancing algorithm is proposed for the new topology and is validated by MATLAB/Simulink simulations. A comprehensive comparative analysis with other available submodule topologies is presented to show the added benefits.
AB - Modular multilevel converters have emerged as a viable solution over conventional voltage source converters (VSC) for applications in high voltage direct current (HVDC) transmission. Due to modular structure, the converter can reach high number of voltage levels resulting in low switching frequency and near sinusoidal voltage waveforms. This paper proposes new submodule topologies which can result in even higher voltage levels with reduced voltage stress across some switches and lower semiconductor losses. A modified modulation scheme and voltage balancing algorithm is proposed for the new topology and is validated by MATLAB/Simulink simulations. A comprehensive comparative analysis with other available submodule topologies is presented to show the added benefits.
KW - Carrier based pulse width modulation
KW - HVDC
KW - Modular multilevel converter (MMC)
KW - Submodules (SM)
KW - Voltage balancing algorithm
UR - http://www.scopus.com/inward/record.url?scp=84893571785&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893571785&partnerID=8YFLogxK
U2 - 10.1109/IECON.2013.6700166
DO - 10.1109/IECON.2013.6700166
M3 - Conference contribution
AN - SCOPUS:84893571785
SN - 9781479902248
T3 - IECON Proceedings (Industrial Electronics Conference)
SP - 6269
EP - 6274
BT - Proceedings, IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society
T2 - 39th Annual Conference of the IEEE Industrial Electronics Society, IECON 2013
Y2 - 10 November 2013 through 14 November 2013
ER -