Nature of the silicon and silicon dioxide surfaces during plasma etching with fluorocarbon containing discharges

Eray S. Aydil, Denise C. Marra

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish (US)
Title of host publicationDigest of Papers - Microprocesses and Nanotechnology 1998
Subtitle of host publication1998 International Microprocesses and Nanotechnology Conference
EditorsHyung Joon Yoo, Shinji Okazaki, Jinho Ahn, Ohyun Kim, Masanori Komuro
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages6-7
Number of pages2
ISBN (Electronic)4930813832, 9784930813831
DOIs
StatePublished - Jan 1 1998
Event1998 International Microprocesses and Nanotechnology Conference, MNC 1998 - Kyoungju, Korea, Republic of
Duration: Jul 13 1998Jul 16 1998

Publication series

NameDigest of Papers - Microprocesses and Nanotechnology 1998: 1998 International Microprocesses and Nanotechnology Conference
Volume1998-July

Other

Other1998 International Microprocesses and Nanotechnology Conference, MNC 1998
CountryKorea, Republic of
CityKyoungju
Period7/13/987/16/98

Cite this

Aydil, E. S., & Marra, D. C. (1998). Nature of the silicon and silicon dioxide surfaces during plasma etching with fluorocarbon containing discharges. In H. J. Yoo, S. Okazaki, J. Ahn, O. Kim, & M. Komuro (Eds.), Digest of Papers - Microprocesses and Nanotechnology 1998: 1998 International Microprocesses and Nanotechnology Conference (pp. 6-7). [729911] (Digest of Papers - Microprocesses and Nanotechnology 1998: 1998 International Microprocesses and Nanotechnology Conference; Vol. 1998-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.1998.729911