In electronics industry miniaturization, the problem of component cooling by natural convection is of importance. Electronic chips behave as local thermal sources and dissipation of heat through fins is widely used. Effects of fin length and fin conduction parameter are studied independently. While the cylinder plume has an influence on the fin, the fin has an insignificant effect on the local heat transfer variation around the cylinder.
|Original language||English (US)|
|Number of pages||6|
|Journal||American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD|
|State||Published - Dec 1 1984|