NATURAL CONVECTION HEAT TRANSFER FROM A CONDUCTING FIN ABOVE A HEATED HORIZONTAL CYLINDER.

A. K. Tolpadi, S. S. Kwon, T. H. Kuehn

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

In electronics industry miniaturization, the problem of component cooling by natural convection is of importance. Electronic chips behave as local thermal sources and dissipation of heat through fins is widely used. Effects of fin length and fin conduction parameter are studied independently. While the cylinder plume has an influence on the fin, the fin has an insignificant effect on the local heat transfer variation around the cylinder.

Original languageEnglish (US)
Pages (from-to)85-90
Number of pages6
JournalAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume32
StatePublished - Dec 1 1984

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