Nanomechanical fracture-testing of thin films

M. D. Kriese, D. A. Boismier, N. R. Moody, W. W. Gerberich

Research output: Contribution to journalArticlepeer-review

56 Scopus citations


Nanochemical testing techniques were used to quantitatively assess the adhesion of thin film-substrate systems. These techniques utilized micron-scale diamond tips with instrumentation continuously measuring to sub-nanometer and sub-millinewton resolutions. Delamination was modeled as an interfacial crack propagation problem, utilizing linear elastic fracture mechanics and characterized by the critical strain energy release rate. A 9.1 μm thick phenol-formaldehyde polymer film on stainless steel was tested with indentation, scratching and edge-loading of fine lines. Also, sputtered copper and tungsten-copper bilayer films on SiO2, 150 to 1500 nm thick, were tested with indentation.

Original languageEnglish (US)
Pages (from-to)1-20
Number of pages20
JournalEngineering Fracture Mechanics
Issue number1
StatePublished - Aug 1998


  • Indentation
  • Interfacial fracture
  • Nanomechanics
  • Scratch testing
  • Thin films

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