Multidevice cooling with flow boiling in a variable microgap

S. J. Young, D. Janssen, E. A. Wenzel, B. M. Shadakofsky, Francis A Kulacki

Research output: Contribution to journalArticle

Abstract

Flow boiling in an onboard variable microgap is demonstrated as a viable cooling method for multidevice electronics. The microgap is created by a bonded conformal encapsulation that delivers uniform subcooled inlet coolant flow across a multidevice layout comprising a processor and two in-line, symmetrically placed memory devices. Each device is simulated with a ceramic resistance heater on a 1:1 scale, and the heights of the devices create the variable microgap under the roof line of the encapsulation. The gap height for the processor is 0.5mm and 1mm for the memory devices. Parameters investigated are pressure drop, average device temperature, processor power, and coefficient of performance (COP). For inlet coolant flow first over the memory devices, the average device temperature exceeds the 95 °C limit when processor power is ~50 W or less. For inlet flow over the processor, memory device temperatures are approximately the same over all the levels of processor and memory chip power. For processor power < 30 W and an inlet coolant temperature of 25 °C, single-phase heat transfer is the dominant cooling mechanism. When processor power is > 40 W, two-phase heat transfer dominates, and processor power of 120 W is reached within the 95 °C threshold. Volumetric power density across the data set is 134 to 1209 W/cm3.

Original languageEnglish (US)
Article number061014
JournalJournal of Thermal Science and Engineering Applications
Volume10
Issue number6
DOIs
StatePublished - Dec 1 2018

Fingerprint

boiling
Boiling liquids
central processing units
Cooling
cooling
Data storage equipment
Encapsulation
Coolants
coolants
Inlet flow
Roofs
Temperature
Pressure drop
inlet flow
Electronic equipment
roofs
Heat transfer
pressure drop
heaters
layouts

Keywords

  • Direct liquid cooling
  • Flow boiling
  • Microgap
  • Multidevice layout
  • Onboard encapsulation
  • Thermal management

Cite this

Multidevice cooling with flow boiling in a variable microgap. / Young, S. J.; Janssen, D.; Wenzel, E. A.; Shadakofsky, B. M.; Kulacki, Francis A.

In: Journal of Thermal Science and Engineering Applications, Vol. 10, No. 6, 061014, 01.12.2018.

Research output: Contribution to journalArticle

Young, S. J. ; Janssen, D. ; Wenzel, E. A. ; Shadakofsky, B. M. ; Kulacki, Francis A. / Multidevice cooling with flow boiling in a variable microgap. In: Journal of Thermal Science and Engineering Applications. 2018 ; Vol. 10, No. 6.
@article{37e2720db825481595497a90021c641a,
title = "Multidevice cooling with flow boiling in a variable microgap",
abstract = "Flow boiling in an onboard variable microgap is demonstrated as a viable cooling method for multidevice electronics. The microgap is created by a bonded conformal encapsulation that delivers uniform subcooled inlet coolant flow across a multidevice layout comprising a processor and two in-line, symmetrically placed memory devices. Each device is simulated with a ceramic resistance heater on a 1:1 scale, and the heights of the devices create the variable microgap under the roof line of the encapsulation. The gap height for the processor is 0.5mm and 1mm for the memory devices. Parameters investigated are pressure drop, average device temperature, processor power, and coefficient of performance (COP). For inlet coolant flow first over the memory devices, the average device temperature exceeds the 95 °C limit when processor power is ~50 W or less. For inlet flow over the processor, memory device temperatures are approximately the same over all the levels of processor and memory chip power. For processor power < 30 W and an inlet coolant temperature of 25 °C, single-phase heat transfer is the dominant cooling mechanism. When processor power is > 40 W, two-phase heat transfer dominates, and processor power of 120 W is reached within the 95 °C threshold. Volumetric power density across the data set is 134 to 1209 W/cm3.",
keywords = "Direct liquid cooling, Flow boiling, Microgap, Multidevice layout, Onboard encapsulation, Thermal management",
author = "Young, {S. J.} and D. Janssen and Wenzel, {E. A.} and Shadakofsky, {B. M.} and Kulacki, {Francis A}",
year = "2018",
month = "12",
day = "1",
doi = "10.1115/1.4040965",
language = "English (US)",
volume = "10",
journal = "Journal of Thermal Science and Engineering Applications",
issn = "1948-5085",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "6",

}

TY - JOUR

T1 - Multidevice cooling with flow boiling in a variable microgap

AU - Young, S. J.

AU - Janssen, D.

AU - Wenzel, E. A.

AU - Shadakofsky, B. M.

AU - Kulacki, Francis A

PY - 2018/12/1

Y1 - 2018/12/1

N2 - Flow boiling in an onboard variable microgap is demonstrated as a viable cooling method for multidevice electronics. The microgap is created by a bonded conformal encapsulation that delivers uniform subcooled inlet coolant flow across a multidevice layout comprising a processor and two in-line, symmetrically placed memory devices. Each device is simulated with a ceramic resistance heater on a 1:1 scale, and the heights of the devices create the variable microgap under the roof line of the encapsulation. The gap height for the processor is 0.5mm and 1mm for the memory devices. Parameters investigated are pressure drop, average device temperature, processor power, and coefficient of performance (COP). For inlet coolant flow first over the memory devices, the average device temperature exceeds the 95 °C limit when processor power is ~50 W or less. For inlet flow over the processor, memory device temperatures are approximately the same over all the levels of processor and memory chip power. For processor power < 30 W and an inlet coolant temperature of 25 °C, single-phase heat transfer is the dominant cooling mechanism. When processor power is > 40 W, two-phase heat transfer dominates, and processor power of 120 W is reached within the 95 °C threshold. Volumetric power density across the data set is 134 to 1209 W/cm3.

AB - Flow boiling in an onboard variable microgap is demonstrated as a viable cooling method for multidevice electronics. The microgap is created by a bonded conformal encapsulation that delivers uniform subcooled inlet coolant flow across a multidevice layout comprising a processor and two in-line, symmetrically placed memory devices. Each device is simulated with a ceramic resistance heater on a 1:1 scale, and the heights of the devices create the variable microgap under the roof line of the encapsulation. The gap height for the processor is 0.5mm and 1mm for the memory devices. Parameters investigated are pressure drop, average device temperature, processor power, and coefficient of performance (COP). For inlet coolant flow first over the memory devices, the average device temperature exceeds the 95 °C limit when processor power is ~50 W or less. For inlet flow over the processor, memory device temperatures are approximately the same over all the levels of processor and memory chip power. For processor power < 30 W and an inlet coolant temperature of 25 °C, single-phase heat transfer is the dominant cooling mechanism. When processor power is > 40 W, two-phase heat transfer dominates, and processor power of 120 W is reached within the 95 °C threshold. Volumetric power density across the data set is 134 to 1209 W/cm3.

KW - Direct liquid cooling

KW - Flow boiling

KW - Microgap

KW - Multidevice layout

KW - Onboard encapsulation

KW - Thermal management

UR - http://www.scopus.com/inward/record.url?scp=85054080416&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85054080416&partnerID=8YFLogxK

U2 - 10.1115/1.4040965

DO - 10.1115/1.4040965

M3 - Article

AN - SCOPUS:85054080416

VL - 10

JO - Journal of Thermal Science and Engineering Applications

JF - Journal of Thermal Science and Engineering Applications

SN - 1948-5085

IS - 6

M1 - 061014

ER -