Morphological stability of diffusion couples under electric current

Perry H Leo, Ana Rasetti

Research output: Contribution to journalArticle

Abstract

We consider the growth and morphological stability of an intermediate phase growing in a binary diffusion couple under electromigration conditions. The growth rate of the intermediate phase depends primarily on the direction of the electromigration current. Current flow that drives the diffusing species enhances growth of the intermediate phase, while current flow in the opposite direction slows growth. The morphological stability of the interfaces between the intermediate phase and the terminal phases depends on the current direction, the relative conductivities of the phases, and the thickness of the intermediate phase. We find that, when the intermediate phase has a higher conductivity than the terminal phases, the current direction that enhances growth of the intermediate phase can also cause an instability. Alternatively, when the conductivity of the intermediate phase is lower than the surrounding phases, the current direction that slows growth can cause an instability. Instability also requires that the thickness of the intermediate phase be larger than some critical value.

Original languageEnglish (US)
Pages (from-to)2687-2695
Number of pages9
JournalJournal of Electronic Materials
Volume39
Issue number12
DOIs
StatePublished - Dec 1 2010

Fingerprint

Electric currents
electric current
Electromigration
electromigration
conductivity
causes
Direction compound

Keywords

  • Electromigration
  • diffusion
  • morphological stability

Cite this

Morphological stability of diffusion couples under electric current. / Leo, Perry H; Rasetti, Ana.

In: Journal of Electronic Materials, Vol. 39, No. 12, 01.12.2010, p. 2687-2695.

Research output: Contribution to journalArticle

@article{5d26c35a26f2454d851b09ccd26f52fe,
title = "Morphological stability of diffusion couples under electric current",
abstract = "We consider the growth and morphological stability of an intermediate phase growing in a binary diffusion couple under electromigration conditions. The growth rate of the intermediate phase depends primarily on the direction of the electromigration current. Current flow that drives the diffusing species enhances growth of the intermediate phase, while current flow in the opposite direction slows growth. The morphological stability of the interfaces between the intermediate phase and the terminal phases depends on the current direction, the relative conductivities of the phases, and the thickness of the intermediate phase. We find that, when the intermediate phase has a higher conductivity than the terminal phases, the current direction that enhances growth of the intermediate phase can also cause an instability. Alternatively, when the conductivity of the intermediate phase is lower than the surrounding phases, the current direction that slows growth can cause an instability. Instability also requires that the thickness of the intermediate phase be larger than some critical value.",
keywords = "Electromigration, diffusion, morphological stability",
author = "Leo, {Perry H} and Ana Rasetti",
year = "2010",
month = "12",
day = "1",
doi = "10.1007/s11664-010-1368-0",
language = "English (US)",
volume = "39",
pages = "2687--2695",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "12",

}

TY - JOUR

T1 - Morphological stability of diffusion couples under electric current

AU - Leo, Perry H

AU - Rasetti, Ana

PY - 2010/12/1

Y1 - 2010/12/1

N2 - We consider the growth and morphological stability of an intermediate phase growing in a binary diffusion couple under electromigration conditions. The growth rate of the intermediate phase depends primarily on the direction of the electromigration current. Current flow that drives the diffusing species enhances growth of the intermediate phase, while current flow in the opposite direction slows growth. The morphological stability of the interfaces between the intermediate phase and the terminal phases depends on the current direction, the relative conductivities of the phases, and the thickness of the intermediate phase. We find that, when the intermediate phase has a higher conductivity than the terminal phases, the current direction that enhances growth of the intermediate phase can also cause an instability. Alternatively, when the conductivity of the intermediate phase is lower than the surrounding phases, the current direction that slows growth can cause an instability. Instability also requires that the thickness of the intermediate phase be larger than some critical value.

AB - We consider the growth and morphological stability of an intermediate phase growing in a binary diffusion couple under electromigration conditions. The growth rate of the intermediate phase depends primarily on the direction of the electromigration current. Current flow that drives the diffusing species enhances growth of the intermediate phase, while current flow in the opposite direction slows growth. The morphological stability of the interfaces between the intermediate phase and the terminal phases depends on the current direction, the relative conductivities of the phases, and the thickness of the intermediate phase. We find that, when the intermediate phase has a higher conductivity than the terminal phases, the current direction that enhances growth of the intermediate phase can also cause an instability. Alternatively, when the conductivity of the intermediate phase is lower than the surrounding phases, the current direction that slows growth can cause an instability. Instability also requires that the thickness of the intermediate phase be larger than some critical value.

KW - Electromigration

KW - diffusion

KW - morphological stability

UR - http://www.scopus.com/inward/record.url?scp=78049529654&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78049529654&partnerID=8YFLogxK

U2 - 10.1007/s11664-010-1368-0

DO - 10.1007/s11664-010-1368-0

M3 - Article

AN - SCOPUS:78049529654

VL - 39

SP - 2687

EP - 2695

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 12

ER -