Abstract
This paper presents the design and test results of a prototype monolithic pixel sensor manufactured in deep-submicron fully depleted Silicon-On-Insulator (SOI) CMOS technology. In the SOI technology, a thin layer of integrated electronics is insulated from a (high-resistivity) silicon substrate by a buried oxide. Vias etched through the oxide allow to contact the substrate from the electronics layer, so that pixel implants can be created and a reverse bias can be applied. The prototype chip, manufactured in OKI 0.15 μ m SOI process, features both analog and digital pixels on a 10 μ m pitch. Results of tests performed with an infrared laser and 1.35 GeV electrons and a first assessment of the effect of ionising and non-ionising doses are discussed.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 380-384 |
| Number of pages | 5 |
| Journal | Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment |
| Volume | 604 |
| Issue number | 1-2 |
| DOIs | |
| State | Published - Jun 1 2009 |
Bibliographical note
Funding Information:This work was supported by the Director, Office of Science, of the US Department of Energy under Contract no. DE-AC02-05CH11231. We thank the staff of the LBNL Advanced Light Source and 88-in. Cyclotron for their assistance and for the excellent performance of the machines.
Keywords
- CMOS technology
- Monolithic pixel sensor
- Particle detection
- SOI
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