Modeling and simulation of power-electronic inverters in analog electronic circuit simulators

Ryan Billmeyer, Minghui Lu, Brian Johnson, Sairaj Dhople

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper demonstrates how equivalent-circuit representations of grid-following power-electronic inverters can be realized within a SPICE-based development environment using common circuit components and VerilogA code. This facilitates computationally lean simulations of inverter networks leveraging the strengths of SPICE in large-scale simulations. We validate the approach with time-domain simulations for a modified version of the IEEE standard 118-bus system modeled in Virtuoso (a SPICE-based solver). Simulation results are compared-focusing on accuracy and computation speed-with results from a commonly used power-electronics simulation package. We note a significant decrease in simulation time with comparable signal resolution when simulating the network in SPICE.

Original languageEnglish (US)
Title of host publication2021 IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728192017
DOIs
StatePublished - May 1 2021
Event53rd IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Daegu, Korea, Republic of
Duration: May 22 2021May 28 2021

Publication series

Name2021 IEEE International Symposium on Circuits and Systems (ISCAS)

Conference

Conference53rd IEEE International Symposium on Circuits and Systems, ISCAS 2021
Country/TerritoryKorea, Republic of
CityDaegu
Period5/22/215/28/21

Bibliographical note

Funding Information:
This work was supported in part by the UMN Undergraduate Research Opportunities Program, National Science Foundation grant 1453921, U.S. Department of Energy’s Office of Energy Efficiency and Renewable Energy (EERE) under Solar Energy Technologies Office (SETO) Agreement Number EE0009025, and the Washington Research Foundation.

Publisher Copyright:
© 2021 IEEE

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