Micromachining of highly reproducible step substrates for high Tc step junction dc-SQUIDs

J. Wang; B. Han; G. Chen; Q. Yang; T. Cui

doi:10.1007/s00542-002-0278-3

Micromachining of highly reproducible step substrates for high Tc step junction dc-SQUIDs

J. Wang
, B. Han
, G. Chen
, Q. Yang
, T. Cui

Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

A means to successfully fabricate highly reproducible SrTiO₃ step substrates for high T_c dc-Supercon-ducting Quantum Interference Devices (dc-SQUIDs) by micromachining is reported in this paper. At optimized Ar ion milling conditions, an inclined angle from 45 to 50° and a laid angle from 30 to 45°, the highest step angles can be obtained. Under strict process control, the profile of the Nb mask film is clean and sharp. The fabricated step angles are about 71° with steep and flawless topography. The step substrate yield for YBa₂Cu₃O_7-x Josephson step edge junction dc-SQUIDs is 75%. The variation of junction resistance and critical current is ±28.6% and ±42.4% respectively.

Original language	English (US)
Pages (from-to)	480-483
Number of pages	4
Journal	Microsystem Technologies
Volume	9
Issue number	6-7
DOIs	https://doi.org/10.1007/s00542-002-0278-3
State	Published - Sep 2003

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title = "Micromachining of highly reproducible step substrates for high Tc step junction dc-SQUIDs",

abstract = "A means to successfully fabricate highly reproducible SrTiO3 step substrates for high Tc dc-Supercon-ducting Quantum Interference Devices (dc-SQUIDs) by micromachining is reported in this paper. At optimized Ar ion milling conditions, an inclined angle from 45 to 50° and a laid angle from 30 to 45°, the highest step angles can be obtained. Under strict process control, the profile of the Nb mask film is clean and sharp. The fabricated step angles are about 71° with steep and flawless topography. The step substrate yield for YBa2Cu3O7-x Josephson step edge junction dc-SQUIDs is 75\%. The variation of junction resistance and critical current is ±28.6\% and ±42.4\% respectively.",

author = "J. Wang and B. Han and G. Chen and Q. Yang and T. Cui",

year = "2003",

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doi = "10.1007/s00542-002-0278-3",

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TY - JOUR

T1 - Micromachining of highly reproducible step substrates for high Tc step junction dc-SQUIDs

AU - Wang, J.

AU - Han, B.

AU - Chen, G.

AU - Yang, Q.

AU - Cui, T.

PY - 2003/9

Y1 - 2003/9

N2 - A means to successfully fabricate highly reproducible SrTiO3 step substrates for high Tc dc-Supercon-ducting Quantum Interference Devices (dc-SQUIDs) by micromachining is reported in this paper. At optimized Ar ion milling conditions, an inclined angle from 45 to 50° and a laid angle from 30 to 45°, the highest step angles can be obtained. Under strict process control, the profile of the Nb mask film is clean and sharp. The fabricated step angles are about 71° with steep and flawless topography. The step substrate yield for YBa2Cu3O7-x Josephson step edge junction dc-SQUIDs is 75%. The variation of junction resistance and critical current is ±28.6% and ±42.4% respectively.

AB - A means to successfully fabricate highly reproducible SrTiO3 step substrates for high Tc dc-Supercon-ducting Quantum Interference Devices (dc-SQUIDs) by micromachining is reported in this paper. At optimized Ar ion milling conditions, an inclined angle from 45 to 50° and a laid angle from 30 to 45°, the highest step angles can be obtained. Under strict process control, the profile of the Nb mask film is clean and sharp. The fabricated step angles are about 71° with steep and flawless topography. The step substrate yield for YBa2Cu3O7-x Josephson step edge junction dc-SQUIDs is 75%. The variation of junction resistance and critical current is ±28.6% and ±42.4% respectively.

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DO - 10.1007/s00542-002-0278-3

M3 - Article

AN - SCOPUS:0242664117

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VL - 9

SP - 480

EP - 483

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 6-7

ER -

Micromachining of highly reproducible step substrates for high Tc step junction dc-SQUIDs

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