Micromachined low dispersion interconnects for optoelectronic array packaging

S. Riki Banerjee, Rhonda Franklin Drayton

Research output: Contribution to journalConference articlepeer-review

10 Scopus citations

Abstract

A micromachined microstrip interconnect, partially shielded on the top surface, is designed, fabricated, and measured for use in optical array packaging applications. Field simulations show the interconnects to be highly isolated for an array pitch of 500 μm. S-parameter, relative phase constant, and attenuation curves are shown up to 40 GHz for 1 cm long 50-ohm designs. The structure exhibits 1.4 dB/cm of attenuation at 40 GHz and a phase constant that has only ± 0.5% variation across the band. The micromachined partially shielded microstrip offers high isolation, low dispersion, and low attenuation that is necessary for arrayed interconnects.

Original languageEnglish (US)
Pages (from-to)1565-1568
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume3
StatePublished - Jan 1 2002
EventIEEE MTT-S International Microwave Symposium Digest - Seattle, WA, United States
Duration: Jun 2 2002Jun 7 2002

Fingerprint

Dive into the research topics of 'Micromachined low dispersion interconnects for optoelectronic array packaging'. Together they form a unique fingerprint.

Cite this