Micromachined drilling of dielectric substrates of varying bandgap using laser accelerated particles

Tirtha Mitra; A. K. Brown; Joseph J Talghader

doi:10.1109/OMN.2017.8051486

Micromachined drilling of dielectric substrates of varying bandgap using laser accelerated particles

Tirtha Mitra, A. K. Brown, Joseph J Talghader

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

It has been observed that absorbing particles accelerated by Continuous Wave (CW) lasers initiate catastrophic failure in the form of micromachined drill holes. This process was tested using stainless steel, PMMA, and silica particles with fused silica, sapphire, and spinel substrates. Hole drilling occurred at laser power densities as low as 250kW/cm², far below the damage thresholds seen in typical situations. A potential dependence of accelerated particle breakdown on substrate bandgap may suggest that the underlying physical process is similar to that seen for CW laser breakdown of contaminated optical coatings.

Original language	English (US)
Title of host publication	2017 International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Proceedings
Publisher	IEEE Computer Society
ISBN (Electronic)	9781538607374
DOIs	https://doi.org/10.1109/OMN.2017.8051486
State	Published - Sep 26 2017
Event	22nd International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Santa Fe, United States Duration: Aug 13 2017 → Aug 17 2017

Publication series

Name	International Conference on Optical MEMS and Nanophotonics
ISSN (Print)	2160-5033
ISSN (Electronic)	2160-5041

Other

Other	22nd International Conference on Optical MEMS and Nanophotonics, OMN 2017
Country/Territory	United States
City	Santa Fe
Period	8/13/17 → 8/17/17

Bibliographical note

Publisher Copyright:
© 2017 IEEE.

Keywords

laser acceleration
laser machining
particles

Publisher link

10.1109/OMN.2017.8051486

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Mitra, T., Brown, A. K., & Talghader, J. J. (2017). Micromachined drilling of dielectric substrates of varying bandgap using laser accelerated particles. In 2017 International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Proceedings Article 8051486 (International Conference on Optical MEMS and Nanophotonics). IEEE Computer Society. https://doi.org/10.1109/OMN.2017.8051486

Micromachined drilling of dielectric substrates of varying bandgap using laser accelerated particles. / Mitra, Tirtha; Brown, A. K.; Talghader, Joseph J.
2017 International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Proceedings. IEEE Computer Society, 2017. 8051486 (International Conference on Optical MEMS and Nanophotonics).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Mitra, T, Brown, AK & Talghader, JJ 2017, Micromachined drilling of dielectric substrates of varying bandgap using laser accelerated particles. in 2017 International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Proceedings., 8051486, International Conference on Optical MEMS and Nanophotonics, IEEE Computer Society, 22nd International Conference on Optical MEMS and Nanophotonics, OMN 2017, Santa Fe, United States, 8/13/17. https://doi.org/10.1109/OMN.2017.8051486

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abstract = "It has been observed that absorbing particles accelerated by Continuous Wave (CW) lasers initiate catastrophic failure in the form of micromachined drill holes. This process was tested using stainless steel, PMMA, and silica particles with fused silica, sapphire, and spinel substrates. Hole drilling occurred at laser power densities as low as 250kW/cm2, far below the damage thresholds seen in typical situations. A potential dependence of accelerated particle breakdown on substrate bandgap may suggest that the underlying physical process is similar to that seen for CW laser breakdown of contaminated optical coatings.",

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N2 - It has been observed that absorbing particles accelerated by Continuous Wave (CW) lasers initiate catastrophic failure in the form of micromachined drill holes. This process was tested using stainless steel, PMMA, and silica particles with fused silica, sapphire, and spinel substrates. Hole drilling occurred at laser power densities as low as 250kW/cm2, far below the damage thresholds seen in typical situations. A potential dependence of accelerated particle breakdown on substrate bandgap may suggest that the underlying physical process is similar to that seen for CW laser breakdown of contaminated optical coatings.

AB - It has been observed that absorbing particles accelerated by Continuous Wave (CW) lasers initiate catastrophic failure in the form of micromachined drill holes. This process was tested using stainless steel, PMMA, and silica particles with fused silica, sapphire, and spinel substrates. Hole drilling occurred at laser power densities as low as 250kW/cm2, far below the damage thresholds seen in typical situations. A potential dependence of accelerated particle breakdown on substrate bandgap may suggest that the underlying physical process is similar to that seen for CW laser breakdown of contaminated optical coatings.

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Micromachined drilling of dielectric substrates of varying bandgap using laser accelerated particles

Abstract

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