Micromachined drilling of dielectric substrates of varying bandgap using laser accelerated particles

Tirtha Mitra, A. K. Brown, Joseph J Talghader

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

It has been observed that absorbing particles accelerated by Continuous Wave (CW) lasers initiate catastrophic failure in the form of micromachined drill holes. This process was tested using stainless steel, PMMA, and silica particles with fused silica, sapphire, and spinel substrates. Hole drilling occurred at laser power densities as low as 250kW/cm2, far below the damage thresholds seen in typical situations. A potential dependence of accelerated particle breakdown on substrate bandgap may suggest that the underlying physical process is similar to that seen for CW laser breakdown of contaminated optical coatings.

Original languageEnglish (US)
Title of host publication2017 International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Proceedings
PublisherIEEE Computer Society
ISBN (Electronic)9781538607374
DOIs
StatePublished - Sep 26 2017
Event22nd International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Santa Fe, United States
Duration: Aug 13 2017Aug 17 2017

Publication series

NameInternational Conference on Optical MEMS and Nanophotonics
ISSN (Print)2160-5033
ISSN (Electronic)2160-5041

Other

Other22nd International Conference on Optical MEMS and Nanophotonics, OMN 2017
Country/TerritoryUnited States
CitySanta Fe
Period8/13/178/17/17

Bibliographical note

Funding Information:
The authors would like to thank Joint Technology Office(JTO) and Office of Naval Research (Grant No. N00014-12-1-1030 and N00014-16-1-3118).

Publisher Copyright:
© 2017 IEEE.

Keywords

  • laser acceleration
  • laser machining
  • particles

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