It has been observed that absorbing particles accelerated by Continuous Wave (CW) lasers initiate catastrophic failure in the form of micromachined drill holes. This process was tested using stainless steel, PMMA, and silica particles with fused silica, sapphire, and spinel substrates. Hole drilling occurred at laser power densities as low as 250kW/cm2, far below the damage thresholds seen in typical situations. A potential dependence of accelerated particle breakdown on substrate bandgap may suggest that the underlying physical process is similar to that seen for CW laser breakdown of contaminated optical coatings.
|Original language||English (US)|
|Title of host publication||2017 International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Proceedings|
|Publisher||IEEE Computer Society|
|State||Published - Sep 26 2017|
|Event||22nd International Conference on Optical MEMS and Nanophotonics, OMN 2017 - Santa Fe, United States|
Duration: Aug 13 2017 → Aug 17 2017
|Name||International Conference on Optical MEMS and Nanophotonics|
|Other||22nd International Conference on Optical MEMS and Nanophotonics, OMN 2017|
|Period||8/13/17 → 8/17/17|
Bibliographical noteFunding Information:
The authors would like to thank Joint Technology Office(JTO) and Office of Naval Research (Grant No. N00014-12-1-1030 and N00014-16-1-3118).
© 2017 IEEE.
- laser acceleration
- laser machining