Abstract
High frequency circuit performance is significantly influenced by its RF package configuration. This paper presents the use of Si micromachining to develop a miniature package that conforms to the circuit geometry while providing physical and electromagnetic shielding. The advantages of a conformal package, other than reduced size, are control of package resonances, the capability to isolate individual circuit elements and improve circuit performance through elimination of parasitic radiation. In addition, the use of micromachining provides reduced fabrication tolerances and most importantly lower cost.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1387-1390 |
| Number of pages | 4 |
| Journal | IEEE MTT-S International Microwave Symposium Digest |
| Volume | 3 |
| State | Published - Jan 1 1995 |
| Event | Proceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA Duration: May 16 1995 → May 20 1995 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
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