Micromachined circuits for Mm-wove applications

Rhonda F. Drayton, Linda P.B. Katehi

Research output: Contribution to conferencePaperpeer-review

7 Scopus citations


A novel transmission line which utilizes micromachining techniques in the development of circuits for millimeter-wave applications is presented. Micromachined circuits incorporate the fabrication of an upper-half shielding environment with the circuit geometry. The circuit development requires the use two silicon wafers where one has cavities that have been etched using anisotropic etching while the other one has the planar circuits which have been printed using standard photolithographic techniques. Afterwards, the two wafers are aligned and secured using bonding techniques to form a circuit that has an upper-half shielded cavity incorporated monolithically. This paper presents a detailed description the fabrication procedure necessary for upper-half shielded (UHS) circuits as well as for completely shielded (CS) circuits. Experimental results of the upper half shielded circuits will be presented as compared to theoretical results and conventional coplanar waveguide circuits of the same type.

Original languageEnglish (US)
Number of pages2
StatePublished - 1993
Externally publishedYes
Event1993 23rd European Microwave Conference, EuMA 1993 - Madrid, Spain
Duration: Sep 6 1993Sep 10 1993


Conference1993 23rd European Microwave Conference, EuMA 1993

Bibliographical note

Funding Information:
Acknowledgments This work was partially supported by the Office of Naval Research and the NASA Center of Space Terahertz Technology.

Publisher Copyright:
© 1993 IEEE.


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