Micromachined Circuits for Millimeter- and Sub-millimeter-Wave Applications

Linda P B Katehi; Gabriel M. Rebeiz; Thomas M. Weller; Rhonda F. Drayton; Heng Ju Cheng; John F. Whitaker

doi:10.1109/74.242171

Micromachined Circuits for Millimeter- and Sub-millimeter-Wave Applications

Linda P B Katehi
, Gabriel M. Rebeiz
, Thomas M. Weller
, Rhonda F. Drayton
, Heng Ju Cheng
, John F. Whitaker

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

50 Scopus citations

Abstract

This article reviews recent developments in Si micromachining, as it applies to the design of millimeter- and sub-millimeter-wave circuits. Advances in semiconductor-processing techniques have made it possible to create monolithic geometries which are not bound to the surface of the wafer. These use a third dimension, to provide shapes and exhibit electrical functions, which are not possible through standard microstrip or coplanar-waveguide technologies. A variety of recently developed circuits are presented herein, which demonstrate the numerous capabilities micromachining offers to the circuit and antenna designer. 1045-9243/93/$03.00.

Original language	English (US)
Pages (from-to)	9-17
Number of pages	9
Journal	IEEE Antennas and Propagation Magazine
Volume	35
Issue number	5
DOIs	https://doi.org/10.1109/74.242171
State	Published - 1993

Bibliographical note

Funding Information:
This work has been supported by the Office of Naval Research, the NASA Center for Space Terahertz Technology, the Jet Propulsion Laboratory, and the National Science Foundation.

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SDG 9 Industry, Innovation, and Infrastructure

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@article{e3458420c92f49bbadce2cce9f72c0df,

title = "Micromachined Circuits for Millimeter- and Sub-millimeter-Wave Applications",

abstract = "This article reviews recent developments in Si micromachining, as it applies to the design of millimeter- and sub-millimeter-wave circuits. Advances in semiconductor-processing techniques have made it possible to create monolithic geometries which are not bound to the surface of the wafer. These use a third dimension, to provide shapes and exhibit electrical functions, which are not possible through standard microstrip or coplanar-waveguide technologies. A variety of recently developed circuits are presented herein, which demonstrate the numerous capabilities micromachining offers to the circuit and antenna designer. 1045-9243/93/\$03.00.",

author = "Katehi, \{Linda P B\} and Rebeiz, \{Gabriel M.\} and Weller, \{Thomas M.\} and Drayton, \{Rhonda F.\} and Cheng, \{Heng Ju\} and Whitaker, \{John F.\}",

note = "Funding Information: This work has been supported by the Office of Naval Research, the NASA Center for Space Terahertz Technology, the Jet Propulsion Laboratory, and the National Science Foundation.",

year = "1993",

doi = "10.1109/74.242171",

language = "English (US)",

volume = "35",

pages = "9--17",

journal = "IEEE Antennas and Propagation Magazine",

issn = "1045-9243",

publisher = "IEEE Computer Society",

number = "5",

}

TY - JOUR

T1 - Micromachined Circuits for Millimeter- and Sub-millimeter-Wave Applications

AU - Katehi, Linda P B

AU - Rebeiz, Gabriel M.

AU - Weller, Thomas M.

AU - Drayton, Rhonda F.

AU - Cheng, Heng Ju

AU - Whitaker, John F.

N1 - Funding Information: This work has been supported by the Office of Naval Research, the NASA Center for Space Terahertz Technology, the Jet Propulsion Laboratory, and the National Science Foundation.

PY - 1993

Y1 - 1993

N2 - This article reviews recent developments in Si micromachining, as it applies to the design of millimeter- and sub-millimeter-wave circuits. Advances in semiconductor-processing techniques have made it possible to create monolithic geometries which are not bound to the surface of the wafer. These use a third dimension, to provide shapes and exhibit electrical functions, which are not possible through standard microstrip or coplanar-waveguide technologies. A variety of recently developed circuits are presented herein, which demonstrate the numerous capabilities micromachining offers to the circuit and antenna designer. 1045-9243/93/$03.00.

AB - This article reviews recent developments in Si micromachining, as it applies to the design of millimeter- and sub-millimeter-wave circuits. Advances in semiconductor-processing techniques have made it possible to create monolithic geometries which are not bound to the surface of the wafer. These use a third dimension, to provide shapes and exhibit electrical functions, which are not possible through standard microstrip or coplanar-waveguide technologies. A variety of recently developed circuits are presented herein, which demonstrate the numerous capabilities micromachining offers to the circuit and antenna designer. 1045-9243/93/$03.00.

UR - https://www.scopus.com/pages/publications/0027681627

UR - https://www.scopus.com/pages/publications/0027681627#tab=citedBy

U2 - 10.1109/74.242171

DO - 10.1109/74.242171

M3 - Article

AN - SCOPUS:0027681627

SN - 1045-9243

VL - 35

SP - 9

EP - 17

JO - IEEE Antennas and Propagation Magazine

JF - IEEE Antennas and Propagation Magazine

IS - 5

ER -

Micromachined Circuits for Millimeter- and Sub-millimeter-Wave Applications

Abstract

Bibliographical note

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