Microarchitecture floorplanning for sub-threshold leakage reduction

Hushrav D. Mogal, Kia Bazargan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations


Lateral heat conduction between modules affects the temperature profile of a floorplan, affecting the leakage power of individual blocks which increasingly is becoming a larger fraction of the overall power consumption with scaling of fabrication technologies. By modeling temperature dependent leakage power within a microarchitecture-aware floorplanning process, we propose a method that reduces sub-threshold leakage power. To that end, two leakage models are used: a transient formulation independent of any leakage power model and a simpler formulation derived from an empirical leakage power model, both showing good fidelity to detailed transient simulations. Our algorithm can reduce subthreshold leakage by upto 15% with a minor degradation in performance, compared to a floorplanning process that does not model leakage. We also show the importance of modeling whitespace during floorplanning and its impact on leakage savings.

Original languageEnglish (US)
Title of host publicationProceedings - 2007 Design, Automation and Test in Europe Conference and Exhibition, DATE 2007
Number of pages6
StatePublished - 2007
Event2007 Design, Automation and Test in Europe Conference and Exhibition - Nice Acropolis, France
Duration: Apr 16 2007Apr 20 2007

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591


Other2007 Design, Automation and Test in Europe Conference and Exhibition
CityNice Acropolis


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