Microelectromechanical Systems (MEMS) technology is currently being applied to the structural health monitoring of critical aircraft components. The approach integrates acoustic emission (AE) and vibration monitoring devices with signal processing electronics to provide real-time indicators of incipient failure of aircraft (helicopter) components with a known history of catastrophic failure due to fracture. This paper describes MEMS-based sensor development, piezoelectric microsensor design and fabrication, and signal processing approaches directed toward the realization of inexpensive, multiple, MEMS-based integrated diagnostics "coupons". Initial feasibility data are presented.
|Original language||English (US)|
|Number of pages||6|
|Journal||American Society of Mechanical Engineers, Tribology Division, TRIB|
|State||Published - Dec 1 1997|